Dic Corporation

Makoto Yada

Takeshi Ibe

Naoto Yagi

Hisashi Tanimoto

Junji Yamaguchi

Ryota Yamaguchi

Provided is a method for manufacturing a conductive pillar capable of bonding a substrate and a bonding member with high bonding strength via a bonding layer without employing an electroplating method, and a method for manufacturing a bonded structure by employing this method. A method for manufacturing a conductive pillarincludes, in sequence, the steps of forming a resist layeron a substrateprovided with an electrode pad, the resist layerincluding an opening portionon the electrode pad, forming a thin Cu filmby sputtering or evaporating Cu on a surface of the substrateprovided with the resist layerincluding the opening portion, filling the opening portionwith a fine particle copper paste, and sintering the fine particle copper pasteby heating the substratefilled with the fine particle copper paste

Conductive pillar, method for manufacturing the same, and method for manufacturing bonded structure

An object of the present invention is to provide an imprinting curable composition which includes a silicon-containing polymerizable compound such as polysiloxane, exhibits outstanding adhesion to a substrate and excellent demoldability from a fine pattern mold, and causes very little mold contamination. The object is attained by providing a photo-imprinting curable composition including a polymerizable compound (A) containing a silicon atom in the molecule, a photopolymerization initiator (B) and an additive (C), the additive (C) being a compound represented by the following formula (C1) or (C2):ROCHOX&#x2003;&#x2003;(C1)XOCHOCHOCHOX&#x2003;&#x2003;(C2) (In the formula (C1), Ris a Calkyl group, Xis a hydrogen atom or an acyl group, and n is an integer of 0 to 50. In the formula (C2), Xand Xare each independently a hydrogen atom or an acyl group, and p, q and r are each independently an integer of 1 to 50).

Photo-imprinting curable composition and pattern transferring method using the same

There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25&#xb0; C. and in a state of not containing a solvent is in the range of 3 mPa&#xb7;s to 8,000 mPa&#xb7;s.

Curable composition for imprinting

A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

Curable composition, resist material and resist film

Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

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Sakura, Japan

Makoto Yada