Kyocera Corporation

Makoto Watanabe

Hisatoshi Takada

Arata Okayama

Tatsuru Seto

A thermal head includes: a substrate; a heat generating section which is disposed on the substrate; a plurality of driving ICs including first and second driving ICs which are disposed on the substrate and electrically coupled to the heat generating section; and a cover member covering the first and second driving ICs. The cover member is disposed in an inter-driving IC region between the first driving IC and the second driving IC and above and below the inter-driving IC region, and includes a first void.

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Okaya, Japan

Makoto Watanabe