Canon Kabushiki Kaisha

Sony Corporation

Nippon Zeon Company, Ltd.

Fujitsu Corporation

Nec Corporation

Ricoh Company, Ltd.

Nec Lcd Technologies, Ltd.

Nec Platforms, Ltd.

Makoto Watanabe

Yoshinori Tagawa

Hiroyuki Murayama

Masataka Nagai

Takanobu Manabe

Kenji Fujii

Toshiaki Kurosu

Shuhei Oya

Junichiro Iri

Mitsuru Chida

Kazuhiro Asai

Yusuke Hashimoto

Naruyuki Nojo

Junichi Kobayashi

Keiji Watanabe

Satoru Takahashi

Satoshi Ibe

Jun Yamamuro

Shingo Nagata

Masaki Ohsumi

Taichi Yonemoto

Hiroaki Kusano

Isao Otani

Yoshiyuki Imanaka

Yoshiaki Suzuki

Michiaki Sakamoto

Shinichi Nishida

Jun Hasegawa

Hideki Kimura

Shuji Koyama

Kenji Shibata

Hiroshi Uchida

Masashi Miyagawa

Souta Takeuchi

Kousuke Kubo

Yasushi Iijima

Masahiro Ohmori

Keiichiro Juri

Motoaki Sato

Shinichiro Matsuo

Hiroyuki Abo

Yoshiaki Kurihara

Yoshinobu Urayama

Yuuji Tamaru

Yosuke Suzuki

Mitsunori Toshishige

Masatomo Ojima

Tokudai Ogawa

Jinichi Morimura

Hirohisa Fujita

Tadanobu Nagami

Hiroyuki Takubo

Takeshi Terada

Jun Sakai

Mitsugi Iwahashi

Tatsuya Masukawa

Toshiki Mori

Katsuhiro Imai

Junichi Katou

Fumio Yamada

Yusuke Sasa

Naoko Shohji

Kazuma Tokai

Maho Shimokawa

Jun Yamashita

Provided is a liquid container attachable to a printing apparatus and configured to contain a liquid to be supplied to the printing apparatus, including: a container chamber configured to contain the liquid; a supply unit provided on a tip end side in a direction of attachment to be attached to the printing apparatus and configured to connect the container chamber to the printing apparatus; and a liquid holding unit provided to an inner peripheral surface of the supply unit and capable of holding the liquid by using a capillary force, the liquid leaking out in a case of attaching and detaching the liquid container to and from the printing apparatus, in which a length of the liquid holding unit in the direction of attachment of the liquid container is larger than a length of the liquid holding unit in a direction intersecting with the direction of attachment.

Liquid container and printing apparatus

A cleaning blade includes an elastic member that includes a front edge surface extending in the longitudinal direction of the elastic member and the thickness direction orthogonal to the longitudinal direction and a bottom surface extending in the depth direction orthogonal to the longitudinal direction and the thickness direction, the bottom surface sharing a front edge ridge part with the front edge surface and facing a cleaning target, and a coating layer coating the front edge surface, the front edge ridge part, and the bottom surface, wherein the front edge ridge part coated with the coating layer is in contact with a surface of the cleaning target, and the coating layer has an average thickness that increases with an increase in a distance from the front edge ridge part in the thickness direction on the front edge surface.

Cleaning blade, method of manufacturing the same, process cartridge, and image forming apparatus

Provided is a technique in which liquid leaking in attachment and detachment of a liquid storage container to and from a printing apparatus can be retained with a simple, space-saving configuration. The liquid storage container can be attached to the printing apparatus. The liquid storage container includes a storage portion that stores the liquid, a supply port that supplies the liquid stored in the storage portion to the printing apparatus, and a liquid retaining portion that is capable of retaining the liquid leaking in the attachment and detachment of the liquid storage container to and from the printing apparatus by using capillary force. The liquid retaining portion extends along an outer peripheral surface of the supply port, in an attachment direction in which the liquid storage container is attached to the printing apparatus.

Liquid storage container and printing apparatus

A manufacturing method of a liquid ejection head includes steps of providing an ejection orifice forming member on one surface of a wafer, with an energy-generating element being provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.

Liquid ejection head and manufacturing method thereof

A liquid ejection head includes an ejection-port formed member including liquid ejection ports, a substrate including liquid supply ports for supplying liquid to the ejection ports and a partition between the liquid supply ports, and a substrate supporting member. The liquid supply ports extend along the longitudinal direction of the substrate when viewed from a position facing the main surface of the substrate. The liquid supply ports are arrayed along the lateral direction of the substrate when viewed from the position facing the main surface. The partition includes a non-contact portion that is not in contact with the supporting member and a contact portion that is in contact with the supporting member. Of the liquid supply ports, adjacent liquid supply ports communicate with each other in the lateral direction through a gap between the non-contact portion and the supporting member, and liquid flows through the gap.

Liquid ejection head

A liquid ejection head includes a substrate provided with an energy-generating element, an ejection orifice forming member that is formed on the substrate and includes an ejection orifice from which liquid is ejected, a reinforcing rib provided in the ejection orifice forming member, and a recess that is formed in the substrate and forms a part of a flow path of liquid, wherein the reinforcing rib is disposed in the inside of the recess.

Liquid ejection head and method of manufacturing the same

To provide dummy openings having at least one of arrangement and shape determined depending on the shape of a non-effective region.

Method of manufacturing substrate and semiconductor device

A method for imparting water repellency to a surface of a member includes a step in which a material including a compound containing a fluorine atom is deposited on a surface of a photosensitive resin layer in order to form a member including a material layer; a first exposure step in which the member is exposed to an amount of light with an exposure apparatus in order to form a latent image in the member; a development step in which the member including the latent image is developed; and a second exposure step in which the member is exposed to an amount of light with an exposure apparatus subsequent to the development step.

Method for imparting water repellency to surface of member

There is provided a non-contact communication antenna including a first antenna pattern that is formed on one surface of a base material, and a second antenna pattern that is formed on a back surface of the one surface of the base material. The first antenna pattern includes a first coil section and a first electrode section. The second antenna pattern includes a second coil section and a second electrode section. Capacitance of the first electrode section and the second electrode section compensates a change in capacitance depending on a formation situation of the first coil section and the second coil section.

Non-contact communication antenna, communication device, and method for manufacturing non-contact communication antenna

Performed are a non-through hole forming step of partitioning a supply path forming region of a second surface into a first region corresponding to a forming position of a beam, a second region located adjacent to the first region on both sides thereof, and a third region that is none of the first region and the second region, and forming a plurality of non-through holes in the second region and the third region, and an etching step of subjecting a silicon substrate to anisotropic etching from the second surface, to thereby form the supply path and the beam in the supply path. In the non-through hole forming step, at least one of an interval or a depth of the non-through holes is caused to differ in the second region and the third region, to thereby control the shape and dimension of the beam to be formed in the etching step.

Method of processing a silicon substrate and method of manufacturing a substrate for a liquid ejection head

In order to facilitate connecting to a SIP network, a router () forming a communication system () acquires information from a carrier network () by using DHCP. The information is necessary for connecting to a server (SIP server) placed on the carrier network. Moreover, a communication device () acquires the information from the router () by using local protocol that differs from the SIP and the DHCP. For example, UPnP protocol is adopted as the local protocol.

Communication device, router, communication system, and controlling methods for communication device and router

A liquid discharge head includes a substrate, a heat resistor layer, and a side wall member that forms a side wall of a pressure chamber. The heat resistor layer has a heat effect portion configured to foam liquid in an interior of the pressure chamber to discharge liquid from a discharge port. The heat effect portion is apart from the substrate, at least part of a surface of the heat resistor layer is covered with a covering layer in the interior of the pressure chamber, and the covering layer extends from the interior of the pressure chamber to a position coming into contact with the side wall of the side wall member.

Liquid discharge head

A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).

Process for producing a semiconductor chip

A liquid ejection head includes a substrate which has an energy-generating element that generates energy to be utilized for ejecting a liquid, and a supply orifice for supplying the liquid to the energy-generating element; and an ejection orifice forming member that has a plurality of ejection orifices through which the liquid is ejected, and at least one beam-like projection which projects toward the substrate and extends along an array direction of the ejection orifices at a position corresponding to the supply orifice. A sectional area perpendicular to the array direction of the ejection orifices at the central part of the beam-like projection in the array direction of the ejection orifices is larger than a sectional area in the direction perpendicular to the array direction of the ejection orifices at both ends of the beam-like projection in the array direction.

A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on the photosensitive resin material by performing a developing operation. The exposure light in the step of reduction-projection-exposing is passed through a correction mechanism before the exposure light reaches the photosensitive resin material, the correction mechanism being configured to suppress an inclination of a chief ray due to off-axis telecentricity that occurs in the reduction-projection-exposure apparatus.

Method of making nozzle chip

Growing community of inventors

Yokohama, Japan

Makoto Watanabe