Ushio Denki Kabushiki Kaisha

Makoto Wasamoto

Shinji Suzuki

Fumitoshi Takemoto

Kenichi Hirose

Shinichi Endo

A curing process of an ultraviolet curable paint by which a paint cured layer can be formed on an object to be processed without needing a long time, and intended color can be obtained of the object to be processed on which the paint cured layer is formed. The curing process of an ultraviolet curable paint is one for curing an ultraviolet curable paint through an ultraviolet irradiation step of irradiating a surface of an object to be processed to which the ultraviolet curable paint is applied with ultraviolet rays from an ultraviolet radiation unit. The ultraviolet curable paint is not sensitive to light of not less than 380 nm in wavelength but sensitive to light of less than 380 nm in wavelength. The ultraviolet radiation unit radiates ultraviolet rays having a peak wavelength within a range of not greater than 350 nm in wavelength.

Curing process of ultraviolet curable paint

An object of the present invention is to provide a method of joining resin tubes, in which the degree of freedom of selecting a tube material is large, and further a defect such as stiffness and contraction at joining portions of the tubes is not developed. The method of joining resin tubes according to the present invention is a method of joining resin tubes so that a first tube is joined to a second tube, the first tube and the second tube each being made of synthetic resin, the method comprising: a surface activation step of activating each of a joining region of the first tube and a joining region of the second tube; and an adhesion step of adhering the joining region of the first tube obtained via the surface activation step with the joining region of the second tube obtained via the surface activation step to each other.

Method of joining resin tubes

A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.

Wiring board desmear treatment method

An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein. The process for laminating works together laminates a work composed of a resin to a work composed of a resin or glass, the process including a surface activation step of treating a laminating surface of at least the work composed of a resin with vacuum ultraviolet ray or with atmospheric pressure plasma, and a bonding step of bonding together the two works stacked on each other such that a laminating surface of one of the works abuts a laminating surface of the other work, wherein in the surface activation step, the treatment of the laminating surfaces with vacuum ultraviolet ray or with atmospheric pressure plasma is terminated when an accumulated treatment quantity of the vacuum ultraviolet ray or the atmospheric pressure plasma applied to the laminating surfaces is within an initial drop range shown in a variation curve of a water contact angle on the laminating surfaces with respect to the accumulated treatment quantity.

Growing community of inventors

Tokyo, Japan

Makoto Wasamoto