Ngk Spark Plug Company, Limited

Nrk Spark Plug Co., Ltd.

Makoto Wakazono

Seiji Mori

Tomohiro Nishida

Takahiro Hayashi

Tatsuya Ito

Makoto Nagai

Toshifumi Kojima

Makoto Origuchi

Takeshi Toyoshima

Toshikatu Takada

To provide a wiring board ensuring adhesion strength of a connecting terminal to reduce the connecting terminal from being fallen over or peeled off under fabrication process. The wiring board according to the present invention includes a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body and a filling member filled up between the plurality of connecting terminals. The filling member is filled up to a position lower than a height of the plurality of connecting terminals. The connecting terminals has a cross section with a trapezoidal shape where a width of a first principal surface on a side contacting the laminated body is wider than a width of a second principal surface facing the first principal surface.

Wiring board

To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.

In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0&#xb0; but smaller than 90&#xb0; is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.

Wiring board having an opening with an angled surface

To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layerwhere resin insulating layersandand a conductor layerare laminated is formed at a substrate main surfaceside of an organic wiring board. The conductor layerfor an outermost layer in the first buildup layerincludes a plurality of connecting terminal portionsfor flip-chip mounting a semiconductor chip. The plurality of connecting terminal portionsis exposed through an opening portionof a solder resist layer. Each connecting terminal portionincludes a connection regionfor a semiconductor chip and a wiring regiondisposed to extend from the connection regionalong the planar direction. The solder resist layerincludes, within the opening portion, a side-surface covering portionthat covers the side surface of the connecting terminal portionand a projecting wall portionthat is integrally formed with the side-surface covering portionand disposed to project so as to intersect with the connection region

Wiring board and method for manufacturing same

A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.

Wiring substrate having a plurality of connection terminals and a filling member provided therebetween

To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.

Wiring board and manufacturing method of the same

To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body, a filling member filled up between the plurality of connecting terminals, and a solder resist layer laminated on the laminated body. The filling member is in contact with at least a part of each side surface of the plurality of connecting terminals. The solder resist layer includes an opening that exposes the plurality of connecting terminals. The filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.

A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Wiring substrate and method for producing wiring substrate

A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.

Filling material, multilayer wiring board, and process of producing multilayer wiring board

A multilayer wiring board () is provided which includes a core substrate () including a plurality of through-holes (). The through-holes () include through-hole conductors () on the inner walls of corresponding penetration holes () of a diameter of 200 &#x3bc;m or less. Interlayer insulating layers () are disposed on opposite sides of the principal planes () of the core substrate (). Wiring layers () are disposed on the surface of interlayer insulating layers (). The through-holes () are filled with a hardened filling material (). Lid conductors () close the openings of the through-holes (). The value of linear expansion of the hardened filling material () is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.

Growing community of inventors

Niwa-gun, Japan

Makoto Wakazono