Denso Corporation

Denso Wave Corporation

Ube Exsymo Co., Ltd.

Makoto Totani

Toshihiro Miyake

Yoshitaro Yazaki

Hiroaki Tanaka

Inao Toyoda

Tomohiro Yokochi

Ichiharu Kondo

Takehito Teramae

Kazuyuki Deguchi

Hajime Nakagawa

Katsuaki Kojima

Akinari Higashida

Taro Suzuki

Eijirou Miyagawa

Kouji Kondoh

Mitsutoshi Miyazaki

Tomoyuki Nanami

Fumio Kojima

Hiroyasu Iwama

Hiroki Miyagawa

Kenzo Hirano

Eisuke Tachibana

Junya Kasahara

Takao Arima

Hiroaki Maeda

A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

Flexible laminated board and multilayer circuit board

A printed circuit boardand an FPC boardto be connected together are each given a multilayer structure wherein insulating filmsand interconnection patternsare stacked alternately. In the FPC board, connecting signal lines are distributed among the multilayered interconnection patterns, and in the printed circuit board, interconnecting to landsformed on a connection face thereof is carried out using interconnection patternsof inner layers. By this means, it is possible to greatly increase the number of connecting signal lines between the printed circuit boardand the FPC board

Circuit board and circuit board connection structure

A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.

Compact pressure sensor with high corrosion resistance and high accuracy

Equipment for bonding a flexible printed circuit board made of thermoplastic resin on a printed circuit board includes a heater and a jig. The heater head presses and heats the flexible printed circuit board. The jig prevents the thermoplastic resin from flowing out when the flexible printed circuit is bonded on the printed circuit board. The jig is to be disposed between the flexible printed circuit board and the heater head. The jig includes a thin plate having a base plate and a wing plate. The base plate is parallel to a top surface of the heater head to be sandwiched between the flexible printed circuit board and the heater head. The wing plate is disposed on both sides of the base plate to bend from the base plate.

Equipment for bonding printed circuit boards

A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.

Pressure sensor

A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.

A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

Method for connecting printed circuit boards and connected printed circuit boards

Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Connecting structure of printed circuit boards

An interconnection structure has a first printed circuit board including an insulating substrate made of a thermoplastic resin and a first board conductive pattern with a land, a second printed circuit board overlapped with the first printed circuit board, and including a second board conductive pattern with a land that is electrically interconnected with the land of the first printed circuit board to form an interconnection portion between the first board conductive pattern and the second board conductive pattern. A part of the thermoplastic resin constituting the insulating substrate of the first printed circuit board extends to seal the interconnection portion. The insulating substrate of the first printed circuit board is adhered to an insulating substrate of the second printed circuit through an adhesion enhancing layer in which a material for lowering a modulus of elasticity of the insulating substrate of the first printed circuit board is dispersed therein.

Interconnection structure for interconnecting printed circuit boards

Connecting method and connecting structure of printed circuit boards

In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.

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Kariya, Japan

Makoto Totani