Murata Manufacturing Co., Ltd.

Makoto Tose

Masatoshi Nakagawa

Shizuharu Watanabe

Toshimaro Yoneda

Yoshihiro Koshido

Takeshi Nakao

Hiromichi Kawakami

Koji Yoshida

Michio Kadota

Masato Kobayashi

Toshio Hagi

Koji Fujimoto

Michiaki Iha

Masayuki Yoneda

Masayuki Suzuki

Tadayuki Okawa

A surface acoustic wave device includes a piezoelectric substrate and at least one interdigital electrode disposed on the piezoelectric substrate. The interdigital electrode is made of &#x3b1;-tantalum.

Method of manufacturing a surface acoustic wave device

A surface acoustic wave device includes a piezoelectric plate and at least one interdigital electrode provided on the piezoelectric plate. The interdigital electrode includes a first metallic thin film and a second metallic thin film laminated on the first metallic thin film and containing tantalum as a principal component, and at least a portion of the tantalum of the second metallic thin film is &agr;-tantalum.

Method for manufacturing a surface acoustic wave device

A method for manufacturing a surface acoustic wave apparatus decreases a specific resistance of an electrode film by removing hydrogen occluded in the electrode film that is primarily composed of tantalum, so that the device properties are stabilized. An electrode film primarily composed of tantalum is formed on a piezoelectric substrate. Subsequently, this electrode film is heat-treated in a vacuum at a temperature of about 200&deg; C. to about 700&deg; C. for several hours. Thereafter, the electrode film is patterned so as to produce an interdigital electrode transducer.

Method for manufacturing surface acoustic wave apparatus

Method of manufacturing a circuit board

A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.

Photosensitive insulating paste and thick film multi-layer circuit substrate

A method of forming an electrode film using a vacuum deposition apparatus, includes the steps of depositing a refractory metal on a substrate after reaching a back pressure in a deposition chamber at a pressure that is within a range of about 1&times;10 Pa to about 5&prime;10 Pa, and annealing the substrate on which the metal is deposited to decrease the electrical resistivity of the electrode film.

Method of forming electrode film

A surface modification layer having a surface modification coefficient of 0.1 to 0.5 is formed on the surface of an organic insulating film on a substrate. A metal wiring is provided on the surface of the organic insulating film having the surface modification layer formed at the surface thereof. Thus, the bonding strength between the metal wiring and the organic insulating film is enhanced. The surface modification coefficient is defined by the formula:

Thin-film circuit substrate and method of producing same

A thin film circuit substrate is manufactured by forming a lower thin film electrode on a substrate, forming an organic insulating film with via holes on the lower thin film electrode, and irradiating the substrate with an inert gas ion to remove an oxidized surface film on the lower thin film electrode, and to generate functional groups, such that a modified surface layer with a surface modification coefficient of about 0.1 to about 0.5 is formed on the surface of the organic insulating film, and such that the oxidized surface film on the lower thin film electrode is removed at the same time. Accordingly, a thin film circuit substrate having excellent adhesion strength between the organic insulating film and the upper thin film electrode as well as excellent reliability of electroconductivity between the upper and the lower thin film electrodes is efficiently manufactured.

Thin film circuit substrate and manufacturing method therefor

A surface acoustic wave device includes a piezoelectric substrate and at least one interdigital electrode disposed on the piezoelectric substrate. The interdigital electrode is made of &agr;-tantalum.

Surface acoustic wave device and method of producing the same

Surface acoustic wave device and method for manufacturing the same

A photosensitive insulating paste including an insulating material containing a borosilicate glass powder. The insulating material is dispersed in a photosensitive organic vehicle, and the borosilicate glass powder contains SiO , B O and K O such that the compositional proportions by weight of the three components represented by (SiO , B O , K O) fall within a region formed by connecting points A (65, 35, 0), B (65, 25, 10), C (85, 5, 10) and D (85, 15, 0) in a ternary diagram thereof. A thick-film multi-layer circuit substrate including the paste is also disclosed.

Photosensitive insulating paste and thick-film multi-layer circuit substrate

The invention provides an insulating paste, comprising: an organic vehicle containing an organic binder, a photo-polymerization initiator and a photosetting monomer; and a silicate glass powder having a softening point in a range of about 700&deg; C. to 1,050&deg; C. and having an average particle size in a range of about 0.1 to 5.0 &mgr;m, said silicate glass powder being dispersed into said organic vehicle. Preferably, the silicate glass powder of the above insulating paste comprises a composition represented by xSiO,-yB,O,-zK,O where x&plus;y&plus;z is 100 parts by weight and the values z, y and z are on lines or within a region enclosed by lines passing through four points A(65, 35, 0), B(65, 20, 15), C(85, 0, 15) and D(85, 15, 0) on a ternary diagram thereof.

Insulating paste

The invention provides an insulating paste, comprising: an organic vehicle containing an organic binder, a photo-polymerization initiator and a photosetting monomer; and a silicate glass powder having a softening point in a range of about 700&deg; C. to 1,050&deg; C. and having an average particle size in a range of about 0.1 to 5.0 &mgr;m, said silicate glass powder being dispersed into said organic vehicle. Preferably, the silicate glass powder of the above insulating paste comprises a composition represented by xSiO,&mdash;yB,0,&mdash;zK,O where x&plus;y&plus;z is 100 parts by weight and the values z, y and z are on lines or within a region enclosed by lines passing through four points A(65, 35, 0), B(65, 20, 15), C(85, 0, 15) and D(85, 15, 0) on a ternary diagram thereof.

Growing community of inventors

Moriyama, Japan

Makoto Tose