Mitsubishi Materials Corporation

Mitsubishi Metal Corporation

Makoto Toriumi

Hideaki Yoshida

Yoshirou Kuromitsu

Hirokazu Tanaka

Michio Yuzawa

Masayoshi Kohinata

Masao Umezawa

A method for joining two ceramic sintered bodies with a joining layer. A magnesium layer is deposited on the ceramic sintered bodies to form a magnesium nitride layer. The joining layer has a component in common with a base component of the ceramic sintered bodies. The laminate is heat treated under conditions that convert the joining layer into a material substantially identical to that of the ceramic sintered bodies, whereby a homogeneous strong laminate results. The ceramic sintered body may be either an oxide, carbide or nitride. The joining layer is a metal corresponding to the base material of the ceramic sintered bodies. After joining, the joining layer is then nitrided. The resulting laminate has improved strength, and heat and corrosion resistance properties.

Method for joining ceramic sintered bodies

A ceramic substrate is used for an electric or electronic circuit, and comprises a ceramic foundation and at least one conductive island formed of aluminum or an aluminum alloy and bonded to one surface of the ceramic foundation for providing conductive paths to circuit components connected thereto, wherein the aluminum or aluminum-alloy island is brazed to the ceramic foundation with a brazing alloy selected from the group consisting of aluminum-silicon alloy, aluminum-germanium alloy, aluminum-silicon-magnesium alloy and aluminum-silicon-germanium alloy so that thermal stress between the ceramic foundation and the conductive island is taken up.

Ceramic substrate used for fabricating electric or electronic circuit

A ceramic substrate is used for an electric or electronic circuit comprises a ceramic plate formed of a substance mainly composed of aluminum nitride, and conductive islands formed of aluminum or an aluminum alloy and bonded to one surface of the ceramic plate for providing conductive paths to circuit components connected thereto, wherein the aluminum islands decrease the total weight of the ceramic substrate and enhance a resistance against repetition of a thermal stress.

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Saitama, Japan

Makoto Toriumi