Kaneka Corporation

Makoto Tawada

Yasutaka Kondo

Kazuhiro Ono

Hiroyuki Ushiro

Shoto Banya

A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300&#xb0; C. or higher.

Polyimide resin, polyimide solution, film, and method for producing same

An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 mand a loop stiffness value of 0.45 g/cm or more.

Insulating coating material having excellent wear resistance

An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k&#xd7;b. . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in &#x3bc;m of the insulating film, and k is 0.000105 or more.

An insulating coating material is provided herein. In some embodiments, the insulating coating material comprises an insulating film comprising a polyimide resin, wherein the insulating film, when measuring a tensile elasticity in accordance with ASTM D882, having a stress at 5% strain of 180 MPa or greater and a stress at 15% strain of 225 MPa or greater, wherein the stress at 15% strain is greater than the stress at 5% strain.

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Otsu, Japan

Makoto Tawada