Sony Computer Entertainment Inc.

Canon Kabushiki Kaisha

Ricoh Company, Ltd.

Renesas Electronics Corporation

Disco Corporation

Mitsubishi Denki Kabushiki Kaisha

Nippon Sanso Corporation

Sony Corporation

Oki Electric Industry Co., Ltd.

Takeda Chemical Industries, Inc.

Seikosha Co., Ltd.

Juki Corporation

Matsushita Electric Industrial Co., Ltd.

Dai Nippon Printing Co., Ltd.

Mitsubishi Hitachi Power Systems, Ltd.

Makoto Tanaka

Tadayuki Tsuda

Kazushi Watanabe

Isao Ikemoto

Kenta Ohno

Kazuhiko Ishiwata

Kanji Yano

Shinichi Sasaki

Toru Akazawa

Akihiro Nakahara

Kazuo Shishido

Shinji Ueki

Rajesh Kumar Dixit

Yasushi Nakazato

Toshiyuki Karakama

Yoshiya Nomura

Shinsuke Watanabe

Hiroyuki Shirai

Masaharu Yoshimori

Akira Nishina

Xin Lu

Yoshihito Ishibashi

Tomoyuki Asano

Taizo Shirai

Shinya Noda

Akira Maeda

Jun Koide

Toru Akishita

Yoshikazu Sasago

Kazumi Sekine

Kazunori Kobayashi

Tsutomu Kikuchi

Takeshi Aoyama

Masahiko Tanaka

Yasumi Yoshida

Tetsuya Kimijima

Takashi Taruki

Katsuyoshi Nomura

Hidetoshi Yoshida

Takashi Yano

Takashi Nakagawa

Gregory J Wolff

Takashi Kimura

Masato Ito

Tsutomu Sasaki

Kenji Kawasaki

Katsumi Kobayashi

Shin Nishimoto

Hiroyuki Endo

Masakazu Yoshida

Shigeru Horiguchi

Masahiro Iezawa

Takayuki Ishii

Nobuya Koike

Toshio Moro

Takanori Miyake

Shinsuke Ubayashi

Takeo Shoji

Kazuyuki Kondo

Akiyuki Hatakeyama

Mamoru Sugimoto

Hiroyuki Shibaki

Masanari Shirai

Kunikazu Tsuda

Kenji Hirai

Yoshihisa Ohta

Akihiko Imagi

Yasunobu Takagi

Marko Balabanovic

Minoru Yoshinaka

Masayuki Kitagawa

Masanori Kusunoki

Hiroyuki Takahara

Shinnosuke Kubota

Shinichi Hatanaka

Takashi Hibi

Susumu Murata

Taku Satoh

Yuji Shimada

Haruo Tsunoi

Tetsuo Yamasaki

Masashi Kohchi

Mitsugu Sugiyama

Hiroyuki Nakazawa

Shinya Yasuda

Toshihide Shiino

Satoshi Hanajima

Tetsuya Hamada

Kiichi Koike

Rikio Kasahara

Keita Takada

Tsuyoshi Yamada

Keiso Shimakawa

Satoshi Miyata

Kentaro Uchiyama

Yoshie Suzuki

Sota Nishiura

Akio Tamagawa

Yasuyuki Yamamoto

Kenkichi Tomita

A bed apparatus includes: a mattress mounted on a bed body; and, first cells arranged on both left and right sides in a longitudinal direction of the bed body and is configured to change the body position of a patient on the mattress by inflating the first cells alternately. When the first cells on the left and right sides are inflated, and when a difference in pressure between the first cells on the left and right sides has continuously fallen within a decision pressure value range for a decision pressure value continuation time, the body position of the patient is changed, whereas when the difference has not continuously fallen within the pressure value range for the continuation time or when the difference has continuously fallen out of the pressure value range for the continuation time, change of the body position of the patient will not be performed.

Bed apparatus and patient detection method

A mattress including air cells that are located on both sides of a user, in which the air cells each have a convex shape on a first side surface, and the air cells are arranged so that the convex shapes thereof are respectively located near shoulder blade outer edges of the user.

Mattress, sheet, bed system, and air cell

A motorized bedding system includes: an acquisition unit that is capable of acquiring a setting of motorized bedding of each of users, a state of each of the users, and snoring detection information of each of the users; a computation unit that is configured to compute a sleep score based on the state of each of the users; a memory that is configured to store data including multiple sets of the setting of the motorized bedding and the sleep score associated with each of the multiple sets of the setting; and an output unit that is configured to output a recommendation setting of the motorized bedding based on the setting associated with the high-level sleep score among the multiple sleep scores stored in the memory, in which the motorized bedding system includes: a first mode where the system automatically changes the setting of the motorized bedding based on the state of each of the users; and a second mode where the system automatically changes the setting of the motorized bedding based on the snoring detection information of each of the users and, in the case where both the first mode and the second mode are activated for a certain user out of the multiple users, upon acquiring the snoring detection information of the certain user, the motorized bedding system prioritizes the second mode over the first mode for the certain user.

Motorized bedding system and application software

A mattress including: an elastic body; a sheet that is disposed at least above the elastic body and made of any of a conductive sheet and a conductive fiber; and a measurement unit that is configured to measure a change of capacitance of the sheet observed when the elastic body is deformed.

Mattress, sensor system

An environmental testing laboratory includes a supply port allowing air-conditioned air at a predetermined temperature supplied through the supply port at a predetermined speed, a discharge port facing the supply port and allowing the air be discharged through the discharge port, a flow passage disposed between the supply port and the discharge port and allowing the air to pass through the flow passage part, an installation part disposed at a center of the flow passage and allowing a measurement target in the installation part, and a flow straightening member which is disposed between a sidewall surface of the flow passage part and the installation part and which is configured to straighten an airflow of the air-conditioned air. The sidewall surface of the flow passage part and the first flow straightening member are disposed in parallel with the airflow of the air-conditioned air from the supply port to the discharge port.

Environmental testing chamber and air-conditioning system

A semiconductor device includes a first transistor that flows a load current to an external load; a current generation circuit that outputs a current corresponding to a power consumption generated in an overheat detection target when the load current flows the overheat detection target; a resistor-capacitor-network comprising a resistor and a capacitor corresponding to a thermal resistance and a thermal capacitance of the overheat detection target, and having one end coupled to the current generation circuit; an overheat detection circuit coupled to a connection point of the current generation circuit and the resistor-capacitor-network; and a voltage source that sets a voltage of the connection point of the current generation circuit and the resistor-capacitor-network to a predetermined voltage.

Semiconductor device

Detection transistor MNd flows a detection current IdN to a current path CPwhen an output voltage Vo generated in a load terminal PNis than a ground voltage GND. A current mirror circuit CMptransfers the detection current IdN flowing in the current path CPto a current path CP. Detecting resistor element Rdconverts a mirror current Iflowing in the current path CPto a detection voltage Vd. A control transistor MNcis turned on when the converted detection voltage Vdis higher than a predetermined value. Then, the output transistor QO is controlled to be off while the control transistor MNcis on.

Semiconductor device and control system

A semiconductor device includes a first transistor that flows a current to a load, a current generation circuit that outputs a current corresponding to a power consumption of the first transistor, a temperature sensor, a resistor-capacitor network coupled between the current generation circuit and the temperature sensor and an overheat detection circuit coupled to a connection point of the current generation circuit and the resistor-capacitor network, wherein the resistor-capacitor network comprises a resistor and a capacitor corresponding to a thermal resistance and a thermal capacitance between the first transistor and the temperature sensor.

Semiconductor device and manufacturing method thereof

A semiconductor device includes a power MOS chip having a source electrode on a surface and a control chip mounted on a portion of the power MOS chip, wherein, viewing from a first outer edge of the power MOS chip extending in a first direction to the control chip, a first column bonding pad and a second column bonding pad are formed in a region of the source electrode where the control chip is not mounted, and wherein a distance between a second outer edge of the power MOS chip extending in a second direction and the first column bonding pad is longer than a distance between the second outer edge and the second column bonding pad.

A manifold for a body support apparatus is disposed in a frame together with an air source. This manifold for a body support apparatus includes: a first opening through which air from the air source is supplied; multiple second openings which are connected to openings of the frame; a space which communicates with the first opening; and multiple flow passages which connect the space and the multiple second openings to each other and are designed to open and close. The inside of this manifold for a body support apparatus is sealed.

Manifold for body support apparatus, and body support apparatus

A method of cutting a workpiece includes forming a guide groove to a depth smaller than the predetermined depth in the workpiece, the guide groove extending from the outer peripheral edge to an end portion of the device area, by causing a cutting blade to cut into the workpiece held on the holding surface of the chuck table from an outer peripheral edge of the workpiece along one of the projected dicing lines; and forming a groove to the predetermined depth in the workpiece along the projected dicing line, the groove extending from the device area beyond an opposite end of the device area to a portion of the outer peripheral extra area, after lowering the cutting blade toward and into the guide groove in the device area and then positioning a cutting edge thereof at the predetermined depth.

Method of cutting workpiece

A packaged wafer processing method includes a processing step of processing each division line formed on a packaged wafer by using a laser beam applying unit and a feeding mechanism, and indexing the wafer by a preset index amount 'a' corresponding to the pitch of the division lines by using an indexing mechanism, thereby forming a laser processed groove along each division line. A correcting step images the next division line to be processed in an exposed peripheral portion of the wafer and the laser processed groove just formed along the present division line, at any arbitrary time during the processing step. The distance 'b' between the next division line and the laser processed groove just formed is determined, and then a correction index amount &#x201c;c&#x201d; is calculated by using the deviation corresponding to the difference (a&#x2212;b) between the preset index amount &#x201c;a&#x201d; and the distance &#x201c;b&#x201d;.

Packaged wafer processing method

A cutting apparatus includes a cutting unit configured to cut a workpiece held on a chuck table, and a groove detecting unit including a CCD imaging element photographing the workpiece held on the chuck table. The groove detecting unit photographs, by the CCD imaging element, a laser-processed groove and a cut groove illuminated by an oblique illumination set such that a light amount of light in a direction parallel with an extending direction of the laser-processed groove as viewed in plan is higher than a light amount of light in a direction orthogonal to the extending direction of the laser-processed groove.

Cutting apparatus and groove detecting method

Growing community of inventors

Tokyo, Japan

Makoto Tanaka