Arisawa Mfg. Co., Ltd.

Makoto Tai

Takashi Gondaira

Hiroyuki Matsuyama

Shuichi Fujita

Nobuyuki Iwano

Kenji Nakamura

Yoshihiko Konno

Takayuki Mayama

Akira Fujita

Kazuo Yoshikawa

Shu Dobashi

A photocurable resin composition according to the present invention contains an anionic-group-containing photosensitive resin comprising a photosensitive urethane resin, a photopolymerization initiator and a thermal curing agent, wherein the photosensitive urethane resin is produced by reacting a raw material mixture containing (A) a polyol having at least an ester bond and also having an unsaturated bond at least in the main chain thereof, (B) a compound having at least one active-hydrogen-containing group and at least one anionic group in the molecule thereof, (C) a polyisocyanate and (D) a compound having at least one active-hydrogen-containing group and an unsaturated bond group in the molecule thereof, and the photosensitive urethane resin has an ester bond and an unsaturated bond in the main chain in the same molecule, wherein at least one of a side chain and a terminal has an anionic group and a side chain has an unsaturated bond group.

Photocurable resin composition and use thereof

A laminate comprising a substrate; and a plating-forming layer disposed on at least one surface of both surfaces of the substrate and containing a thermoplastic resin and a plating catalyst, wherein the plating-forming layer further satisfies conditions of the following (1) and/or (2),

Laminate

This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80&#x25a1; or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 &#x3bc;m, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R, R, X, X, and n are as defined in the description.)

Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display device

The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80&#xb0; C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.

Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device

A multilayer film including alternately-laminated fluororesin layers and polyimide resin layers, wherein a total number of the fluororesin layers and the polyimide resin layers is five or more, a ratio of the total thickness of the fluororesin layers to the thickness of the whole multilayer film is 50% or more, and at least one of the outermost layers of the multilayer film is a fluororesin layer.

Multi-layer film and metal laminate

A laminate comprising a substrate; an adhesive layer formed on at least one surface of both surfaces of the substrate so as to be in direct contact with the substrate; and a plating layer formed on a surface of the adhesive layer opposite to the substrate, wherein the adhesive layer comprises a plating catalyst containing a precious metal, and a silane coupling agent.

Laminate and method for manufacturing the same

The present invention provides a low-dielectric resin composition comprising (A) a urethane resin obtained by reacting a polycarbonate diol and an isocyanate, (B) an epoxy resin, and (C) a filler, wherein the (A) urethane resin has a carboxyl group equivalent weight of 1,100 to 5,700 g/eq; the epoxy equivalent weight of the (B) epoxy resin is 0.3 to 4.5 equivalents per 1.0 equivalent of the carboxyl group of the (A) urethane resin, the (A) urethane resin has a weight-average molecular weight of 5,000 to 80,000; the (A) urethane resin has a polycarbonate content of 35% by mass or lower; the resin composition comprises 50 parts by mass or less of the (C) filler per 100 parts by mass of the (A) urethane resin; and the resin composition comprises substantially no imido group.

Low-dielectric resin composition

The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80&#xb0; C. or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. In formula (1), R, R, X, X, and n are as defined in the description.

The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature (Tg) and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.

Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin composition

A composition for a polyimide resin, comprising a polyamic acid and a perylene black pigment having an isoindole skeleton, wherein

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Joetsu, Japan

Makoto Tai