Fujimi Incorporated

Makoto Tabata

Shinichiro Takami

Shogaku Ide

Provided are a method for polishing a silicon substrate according to which PID can be reduced and a polishing composition set usable in the polishing method. The silicon substrate polishing method provided by this invention comprises a stock polishing step and a final polishing step. The stock polishing step comprises several stock polishing sub-steps carried out on one same platen. The several stock polishing sub-steps comprise a final stock polishing sub-step carried out while supplying a final stock polishing slurry Pto the silicon substrate. The total amount of the final stock polishing slurry Psupplied to the silicon substrate during the final stock polishing sub-step has a total weight of Cu and a total weight of Ni, at least one of which being 1 &#x3bc;g or less.

Method for polishing silicon substrate and polishing composition set

A substrate polishing method includes a stock polishing step comprising a plurality of stock polishing sub-steps in which a first polishing solution, a second polishing solution, and a third polishing solution are applied, in that order, to a substrate. A content COMof water-soluble polymer Pin the first polishing solution, a content COMof water-soluble polymer Pin the second polishing solution, and a content COMof water-soluble polymer Pin the third polishing solution satisfy COM&#x3c;COM&#x3c;COM, and any one of the following conditions is satisfied: (1) average primary particle diameter Dof abrasive Ain the third polishing solution is smaller than average primary particle diameter Dof abrasive Ain the first polishing solution and average primary particle diameter Dof abrasive Ain the second polishing solution; and (2) the third polishing solution does not contain abrasive A.

Method of polishing substrate and polishing composition set

[Problem] To provide a method for producing a polished object, which can remarkably reduce a haze level on a surface of the object to be polished while defects are significantly reduced. [Solution] A method for producing a polished object, which includes a double-side polishing step in which an object to be polished is subjected to double-side polishing using a double-side polishing composition including first abrasive grains having an average primary particle diameter of 40 nm or more and a nitrogen-containing water-soluble polymer to obtain a double-side polished object; and a single-side polishing step in which the double-side polished object is subjected to single-side polishing using a single-side polishing composition including second abrasive grains having an average primary particle diameter of 40 nm or less and a water-soluble polymer, and in which a ratio of an average primary particle diameter (A) of the first abrasive grains with respect to an average primary particle diameter (B) of the second abrasive grains (A)/(B) is more than 1 and 2.5 or less.

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Kiyosu, Japan

Makoto Tabata