Omron Corporation

Makoto Sugimoto

Hiroyuki Mizusaki

Jumpei Nakamura

Tomohiro Tsuji

Daisuke Inoue

Yuki Ushiro

Heita Nada

Yusuke Nakayama

Tsuyoshi Miyata

Hirotaka Nakashima

Kazuyoshi Nishikawa

Takaaki Sanda

Hiroto Katsura

Eiji Teramoto

Takamasa Kameda

Yusuke Hayashi

Naomi Uehara

Kazuyuki Ohashi

Tomonari Imabayashi

Takuya Honjo

Yukitaka Kishimoto

Koichi Hirao

Mikio Hiratsuka

Takashi Yuri

Provided is a photoelectric sensor that enables manufacturing of a sensor with high environmental durability in a case in which there is more variation in case bodies. A photoelectric sensor includes: a package that includes an optical unit and a sealing member that seals the optical unit, and the optical unit includes at least any one of a light projecting portion that emits light and a light receiving portion that detects light; and a case body that accommodates the package, and a gap is provided between the package and the case body.

Photoelectric sensor and manufacturing method thereof

Photoelectric sensor

A photoelectric sensor capable of saving a space is provided. A photoelectric sensor includes a case body with a substantially rectangular parallelepiped shape that accommodates at least one of a light projecting section and a light receiving section. The case body has a front surface that has a light projecting and receiving surface that allows at least one of light from the light projecting section and light to the light receiving section to pass therethrough and a rear surface that is located on a side opposite to the front surface, and a cable that accommodates cords that are connected to at least one of the light projecting section and the light receiving section via a control section is attached to the rear surface.

A photoelectric sensor including at least any one of a light projecting unit for emitting light and a light receiving unit for detecting light includes a substrate on which at least any one of the light projecting unit and the light receiving unit is mounted, a cover which has a protecting portion facing the substrate and for protecting the substrate and a side wall extending from a periphery of the protecting portion, and a sealing member which seals at least any one of the light projecting unit and the light receiving unit that is mounted on the substrate, in which the cover has a protruding portion on a surface which is positioned outside a side surface of the substrate and intersects an extending direction of the side wall, and the protruding portion is in contact with the sealing member.

A sensor device includes: a casing provided with an opening; a cover member covering the opening; a gasket interposed between the cover member and the casing; and a fixing cover which fixes both the gasket and the cover member to the casing. A plurality of welded portions bonding the casing and the fixing cover together are provided in a region outside the cover member such that the welded portions are distant from each other.

Welded sensor device for preventing deformation from heat generation during the welding of the welded sensor device

To provide an electronic apparatus which enables manufacturing costs to be reduced and a range of selection of materials for resin components to be widened. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and an extension part extending from the base and bonding to the sealing resin part. The bonding intermediating part is fixed to the cable by welding the base onto the sheath.

Electronic apparatus and method of manufacturing same

An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member, a cylindrical clamp holding the cable, and a sealing part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath covering the core wire, and the core wire is exposed at an end of the cable without being covered by the sheath. The bonding intermediating member is bonded to the sheath and the sealing part. The sealing part is formed of an epoxy resin, the bonding intermediating part is formed of a resin having a bending elastic modulus in the range of 80 MPa to 210 MPa, and the cable is formed of a material having a suspending flattening ratio in the range of 0.30 to 0.71.

Electronic apparatus

Growing community of inventors

Kyoto, Japan

Makoto Sugimoto