Murata Manufacturing Co., Ltd.

Makoto Shibutani

Toshiyuki Fuyutsume

Shingo Iwasa

A surface acoustic wave device includes a package having an element mounting surface, a surface acoustic wave element provided in the package and having at least one bonding electrode, an adhesive arranged such that the surface acoustic wave element is fixed to the element mounting surface of the package, and at least one bonding wire connected to the at least one bonding electrode. The at least one bonding electrode has at least one line-shaped through hole extending therethrough at a region where the at least one bonding wire is connected to the at least one bonding electrode.

Surface acoustic wave device and method for manufacturing the same

A surface acoustic wave device substantially eliminates a stress caused by a curing shrinkage of an adhesive and substantially eliminates a strain in a case containing a surface acoustic wave element to prevent variation in characteristics of the surface acoustic wave device. In addition, a strength of joining of bonding wires provided in the surface acoustic wave device is improved to have an improved reliability. The surface acoustic wave element of the surface acoustic wave device is fixed on a case member via a soft adhesive and bonding electrodes of the surface acoustic wave element have a plurality of through holes. Ends of the bonding wires are wire-bonded to the bonding electrodes having the through holes formed therein.

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Shiga-ken, Japan

Makoto Shibutani