Sansha Electric Manufacturing Company, Limited

Makoto Sakurada

Toru Arai

Yoshiyuki Nishioka

Masao Katooka

Atsushi Makitani

Yoshimasa Kawashima

A power supply apparatus for use in electroplating includes an input-side rectifier ( ). A rectifier output is converted into high-frequency signals in inverters ( ), which are transformed in transformers ( ). When the transformed high-frequency signals from the transformers are of positive polarity, they are rectified by a diode ( or ) to cause a positive current to be supplied to a load ( ). When the transformed high-frequency signals are of negative polarity, they are rectified by a diode ( or ) to thereby cause a negative current to flow through the load. A first IGBT ( ) is connected in series with each of the diodes ( ) and is rendered conductive and nonconductive at a frequency lower than the high-frequency signal. Also, a second IGBT ( ) is connected in series with each of the diodes ( and ) and is rendered nonconductive when the IGBT and nonconductive at the lower frequency. When the first IGBT is rendered conductive, the second IGBT is rendered nonconductive, and vice versa. The inverters ( ) are controlled in synchronization with the first and second IGBTs ( ) in such a manner that the high-frequency signal can have a larger magnitude when the second IGBT ( ) is conductive than when the first IGBT ( ) is conductive.

AC/DC/HFAC/DC/AC power supply

An electroplating current supply system includes a power supply unit for supplying an object to be plated ( ) with an electroplating current whose polarity is inverted at predetermined intervals. The power supply unit includes a first DC power supply ( A) supplying a positive current and a second power supply ( B) supplying a negative current. The system includes further a processing unit ( ) for controlling the ratio in magnitude and duration of the positive current (I ) to the negative current (I ) supplied to the object so as to plate the object with a uniform coating.

Electroplating current supply system

A power supply device includes power semiconductor devices generating Joule's heat by themselves and circuit components generating no considerable heat by themselves but, as a group, generate a slight rise in temperature, which are included in a power supply circuit of the device. A structure is arranged to forcibly cool these semiconductor devices and circuit components by partitioning the interior of a housing of the Dower supply device to form a passage for an air flow, providing the housing with inlet and outlet openings for the air flow and providing the passage with a ventilating fan.

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Yao, Japan

Makoto Sakurada