Tdk Corporation

Makoto Otomo

Tomokazu Ito

Takashi Kudo

Makoto Yoshida

Nobuyuki Okuzawa

Akira Sato

There is provided a method of manufacturing a coil component, where a first insulation layer is formed on a first magnetic substrate, an insulation film is formed on the first insulation layer, a coil conductor is formed on the insulation film, another insulation film is formed on the coil conductor, and an open region is formed on the inner circumference side and on the outer circumference side of the coil conductor. A magnetic later is embedded, at least partially, in the open region, and a second magnetic substrate is secured on the magnetic layer. Also, a plurality of electrode terminals are formed, where one of the electrode terminals is connected to a terminal portion of the coil conductor, and the electrode terminals are provided across sides of the first and second magnetic substrates. Therefore, the first insulation layer can suitably prevent shorting failures between the electrode terminals.

Method of manufacturing a coil component

An electronic component of the surface-mounted type having a mounting surface that can be mounted on the printed circuit board, maintaining sufficient insulation among the external electrodes despite the chip size is decreased, and having a large mounting strength. In a common mode choke coil array, for example, an external electrode is constituted by electrode pads formed on the mounting surfaces of insulating substrates mounted on a PCB, and a connection electrode which electrically connects an internal electrode terminal exposed on the outer surface different from the mounting surface to the electrode pads. The connection electrodes near the internal electrode terminals have a width c' smaller than a width b of the electrode pads as measured in the same direction.

Electronic component

A thin-film type common-mode choke coil includes a laminated structure having a magnetic substrate; and electrically insulating layers and conductor layers laminated on the magnetic substrate in a direction of thickness, wherein said conductor layers form at least two coil conductors; at least two of the conductor layers are provided as spiral conductor patterns; and the spiral conductor patterns satisfy the expression: 5 &#x3bc;m&#x2266;W&#x2266;36 &#x3bc;m in which Wis the conductor width of each of the spiral conductor patters. The spiral conductor patterns may also satisfy the expression: 100 &#x3bc;m&#x2266;T*Win which T is the conductor thickness of each of said spiral conductor patterns or satisfy the expression: W&#x3c;T&#xd7;2 in which Wis the space between said spiral conductor patterns, and T is the conductor thickness of each of said spiral conductor patterns.

Thin-film type common-mode choke coil

There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.

Coil component and method of manufacturing the same

The invention relates to surface-mount coil component including a mount surface mounted on a printed circuit board or a hybrid IC (HIC), and provides a small and low-profile coil component excellent in impedance characteristic. The coil component includes coil conductors each of which includes a major wiring region having the number N of wiring lines and a minor wiring region arranged to be opposite to the major wiring region and having the number (N&#x2212;1) of wiring lines, and is arranged so that a major wiring side interval as an interval between an outermost periphery of the major wiring region and one side part of the substrate opposite thereto is longer than a minor wiring side interval as an interval between an outermost periphery of the minor wiring region and the other side part of the substrate opposite thereto.

Growing community of inventors

Tokyo, Japan

Makoto Otomo