Shin-etsu Chemical Co., Ltd.

Shin-etsu Handotai Co., Ltd.

Makoto Osuga

Yasuaki Nakazato

Takashi Nihonmatsu

Masao Kodaira

Yasushi Miyazaki

There is disclosed a method of manufacturing semiconductor wafers, in which a lapping process is performed prior to a chamfering process. This makes it possible to manufacture semiconductor wafers while maintaining the smoothness and dimensional accuracy of a chamfered surface of each wafer obtained by the chamfering process.

Method of manufacturing semiconductor wafer

The invention provides a novel apparatus for the wet treatment, e.g. chemical etching treatment, of a plural number of wafer materials such as wafers of high purity silicon semiconductors. The apparatus comprises a liquid tub for containing the treatment liquid, e.g. etching solution, a pair of screw shafts horizontally held in the liquid tub in parallel with each other to be rotatable in the same direction at the same velocity to serve as a kind of screw conveyor and a traveling drum carriage mounted on the screw shafts as engaged with the threads of the shafts at the circular end plates so as to be rotated and transferred in the treatment liquid simultaneously as the screw shafts rotate. The traveling drum carriage holds a wafer basket containing a plural number of the wafer materials perpendicularly to the axis so that the wafer materials are also rotated together with the rotation of the carriage and the surfaces of them are always in contact with the treatment liquid during traveling from one end of the screw shafts to the other.

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Nagano, Japan

Makoto Osuga