Murata Manufacturing Co., Ltd.

Ngk Insulators, Inc.

Makoto Osamura

Noboru Kato

Yoshihito Otsubo

Nobuo Ikemoto

Norio Sakai

Satoshi Sasaki

Koji Shiroki

Yuki Wakabayashi

Yukihisa Wada

Kenji Kubota

Takahisa Kaneko

Masayuki Nate

Takeshi Kurihara

Masami Mizuyama

An RFID module includes a laminated body including thermoplastic resin layers, a passive element defined by a conductor pattern on the thermoplastic resin layers, and an RFID IC chip embedded in the laminated body. The RFID IC chip and the conductor pattern are connected to each other by joining an input and output terminal of the RFID IC chip and a pad electrode, and an insulator pattern overlapping the pad electrode is provided around the RFID IC chip in the laminated body in planar view.

Component built-in device

A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.

Electronic component, method for manufacturing the electronic component, and circuit board

An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.

RFIC chip mounting structure

A radio frequency IC device that prevents variations in the value of capacitive coupling between a radio frequency IC element and a radiation electrode and has good signal transmission efficiency includes a radio frequency IC element including input/output electrodes and, a first base including intermediate electrodes that are capacitively coupled to the input/output electrodes and have capacitance values Cand C, respectively, and a second base including radiation electrodes and that are capacitively coupled to the intermediate electrodes and have capacitance values Cand C, respectively. A capacitance Cobtained by combining Cand Cis smaller than a capacitance Cobtained by combining Cand C

Radio frequency IC device and method of manufacturing the same

A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.

Packaging material with electromagnetic coupling module

Growing community of inventors

Nagaokakyo, Japan

Makoto Osamura