Ngk Spark Plug Company, Limited

Makoto Origuchi

Shinji Yuri

Hajime Saiki

Kazuhiro Urashima

Masaki Muramatsu

Masao Kuroda

Yasuhiro Sugimoto

Tsuneaki Takashima

Tadahiko Kawabe

Jun Otsuka

Kozo Yamasaki

Takahiro Hayashi

Makoto Wakazono

Makoto Nagai

Yukinobu Nagao

Takeshi Toyoshima

Chy Narith

A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Wiring substrate and method for producing wiring substrate

A method for manufacturing a wiring board including, as steps executed in written order: a sub-core accommodation step of accommodating the ceramic sub-core in the sub-core accommodation space through the first-major-surface-side opening of the sub-core accommodation space; and a film formation and charging step of forming a lowest resin insulating layer of the first-major-surface-side wiring laminate by sticking a resin material to the core body and the ceramic sub-core from the first major surface side, and forming a groove-filling portion that is continuous with the lowest resin insulating layer by charging the resin material into a gap between the core body and the ceramic sub-core.

Method for manufacturing a wiring board

A component built-in wiring board is provided. The component built-in wiring boardincludes a core substrate, a first component, a first built-up layerand a capacitor. The core substratehas a housing holeand the first componentis housed in the housing hole. A component mounting regioncapable of mounting a second componentis provided in a surfaceof the first built-up layer. The capacitorhas electrode layersandand a dielectric layer. The capacitoris embedded in the first built-up layersuch that a first front surfaceand a second front surfacein the electrode layerand a first front surfaceand a second front surfacein the electrode layerare disposed in parallel with the surfaceof the first built-up layer

Component built-in wiring board

A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an accommodation step and a height alignment step. In the core board preparation step, a core board having an accommodation hole therein is prepared. In the component preparation step, a ceramic capacitor having therein a plurality of protruding conductors which protrudes from a capacitor rear surface is prepared. In the accommodation step, the ceramic capacitor is accommodated in the accommodation hole with the core rear surface facing the same side as the capacitor rear surface. In the height alignment step, a surface of a top portion of the protruding conductor and a surface of a conductor layer formed on the core rear surface are aligned to the same height.

Wiring board with built-in component and method for manufacturing the same

A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Wiring board

A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

Method for manufacturing wiring board

A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core body; and wiring laminates each formed by resin insulating layers and conductor layers laminated on each of major surfaces of the core board, wherein: a groove-filling portion which fills a gap between the core body and the ceramic sub-core is integral with a lowest resin insulating layer of the first-major-surface-side wiring laminate; and via conductors that are connected to respective conductor patterns formed on a first major surface of the ceramic sub-core penetrate through the lowest resin insulating layer.

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Komaki, Japan

Makoto Origuchi