Mitsubishi Denki Kabushiki Kaisha

The University of Tokyo

Ryoden Kasei Co., Ltd.

Mitsubishi Heavy Industries Bridge & Steel Structures Engineering Co., Ltd.

The Nippon Corrosion Engineering Co., Ltd.

Makoto Omori

Shigeo Onoda

Jun Ohbuchi

Toshinobu Banjo

Hajime Maeda

Katsunori Ochi

Tetsuro Washida

Takeshi Uenaka

Kiyotaka Nishino

Tomomi Morii

Yasuhiro Murasawa

Toru Tachikawa

Yasushi Kasatani

Tomomi Hamada

Kazuyoshi Kihara

Yukio Koibuchi

Yasufumi Kondou

Oki Goto

A coral cultivation method includes: an electrodeposited-mineral precipitating procedure for precipitating electrodeposited minerals on a coral-growth substrate for growing coral, which is placed in seawater, by applying an electric current between the coral-growth substrate and a first anode that is electrically connected to the coral-growth substrate and placed in the seawater; a coral-larvae growing procedure for growing coral larvae on the coral-growth substrate precipitated with the electrodeposited minerals; a coral-cultivation-structure configuring procedure for configuring a coral cultivation structure from a plurality of the coral-growth substrates on which the coral larvae are grown; and a coral cultivating procedure for cultivating coral by applying an electric current between the coral-growth substrate on which the coral larvae are grown and a second anode.

Coral cultivation method, manufacturing method for coral-growth substrate precipitated with electrodeposited minerals, and coral-growth substrate

An IC card that allows fixing the obverse and reverse metal panels to the plastic frame without using adhesion and allows to make conducting electrically between both the metal panels. The IC card 1 includes an electrical circuit board 3 in which electronic components 4 are incorporated, a connector 5 to be connected to an end portion of the electric circuit board, a frame 2 which constitutes an outer frame of the card and a pair of metal panels 6, 7 which cover an obverse and reverse sides of the card. A plurality of tongues 6c, projecting pieces 7c being able to engage with each other are provided on side edge portions of the metal panels 6,7 respectively, while, a plurality of slits into which the projecting pieces 7c of the lower metal panel 7 are to be pressed are provided in the frame 2, and, the projecting pieces 7c are pressed into the slits, also, corresponding tongues 6c of the upper metal panel 6 are engaged with the projecting pieces 7c respectively in a condition of being subject to elastic force of the metal panels.

IC card

In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.

An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).

IC card of simple structure

An IC card adaptor which allows expansion or improvement of the functions of the IC card inexpensively is provided. The IC card adaptor is to be connected with the IC card, in which the IC card is provided with a main-connector for connecting with prescribed electronic equipment on one side and is provided with sub-connectors for connecting with an adaptor on another side. The adaptor is provided with primary connectors to be connected to the sub-connectors of the IC card, a secondary connector to be connected with another piece of electronic equipment or a telecommunication line, and an electric circuit board on which prescribed electronic components are mounted. Both connectors are connected to each other and an adaptor module is constituted on the electric circuit board. The adaptor module is provided with another prescribed function, such as a telephone set, different from functions the IC card primarily possesses.

IC card adaptor and construction of connecting portion between adaptor

An IC card includes a first cover including a first flat panel portion and a first upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion, and a second cover including a second flat panel portion and a second upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion. The first upright wall portion defines a chamber in cooperation with a portion of the first flat panel portion. The first and second covers are mated together with the first and second upright wall portions bonded together in a butt fashion.

IC card and method of making the same

An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used. In a still different way, all the space inside the IC card is filled, or a sufficient amount of an adhesive is filled in a space between the two panels around a peripheral thereof. In a further way, the panels are adhered in a thermostat. In a still further way, the panels are adhered with melting at a peripheral thereof.

An IC card including an electric circuit board and have face and back metallic panels that include a housing and are attached to a resin frame. The IC card has a discharge pattern formed on the electric circuit board for discharging static electricity applied to the metallic panels, a conductor elastically disposed between one of the metallic panels and the discharge pattern for electrically coupling one of the metallic panels with the discharge pattern, and a ground pattern formed on the electric circuit board with the ground pattern separated by a given distance A from the discharge pattern for routing the static electricity to a card connector. The given distance A is a distance necessary for the static electricity to start discharging at a given voltage. A given distance needed for discharge can be maintained precisely through a simple manufacturing process. A fluctuation in discharge start voltage can therefore be minimized. This results in a highly reliable product.

IC card with a discharge pattern and a ground pattern separated from

An IC card with an on-board hard disk unit comprising a frame; a circuit board inside the frame; and a hard disk unit mounted on the circuit board. The IC card also has a metal front panel supported by the frame, and covering the entire IC card, including the hard disk unit. Thus, the outer surface of the IC card is made stronger, and the hard disk is protected from static electricity. The metal front panel includes a first portion where the IC card is relatively thin and a second, bulging portion where the IC card is relatively thick. The bulging portion accommodates the hard disk unit. The front panel may include a vent or mesh.

IC card with on-board hard disk and circuit board with on-board hard

A semiconductor device card system is capable of preventing foreign matter from entering from outside even when a semiconductor device is mounted and to prevent the semiconductor device card from being removed inadvertently. A mounting section of a semiconductor device card is disposed in a semiconductor device card system unit. The mounting section includes an openable mounting section door, and a window for a connector, disposed in the mounting section door, and through which a back-end connector is inserted.

Semiconductor device card system

A memory card having no ordinary type circuit board and a reduced thickness. Insulating layers are disposed on reverse surfaces of a pair of metallic panels, and circuit patterns are formed on the insulating layers. A plurality of electronic parts are mounted on the metallic panels by, for example, being soldered to the circuit patterns. The pair of metallic panels on which the electronic parts are mounted are fitted and bonded to openings formed in a frame of the card so that the electronic parts are accommodated inside the frame facing each other.

Memory card

An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

IC card having adhesion-preventing sheets

An IC card arranged so that a connector cannot come off a frame during an assembly process in which the connector and a circuit board are accommodated in the frame and panels are thereafter attached to obverse and reverse surfaces of the frame. Projections on sides of the connector and resilient engaging/fixing hooks with oblique surfaces on the frame are engaged. As the connector is forced into the frame, the projections of the connector are brought into engagement with and temporarily deflect the engaging/fixing hooks of the frame. The connector is thereby fixed firmly on the frame.

IC card and method of manufacturing the IC card

An IC card has a shutter reciprocatively mounted on a frame in order to protect a plurality of external-element connection terminals which are mounted on the frame. Guide grooves formed in the frame include those which receive corresponding projections formed on spring-mounting portions of the shutter to keep the projections in engagement therewith, thereby enabling both the base portion and the spring-mounting portion of the shutter to be guided. End portions at one end of those guide grooves determine a position of the shutter such that the shutter is prevented from overshooting the frame. Thus, the IC card is capable of ensuring stable opening and closing action of the shutter.

An IC card having a circuit board provided with wiring formed on at least one of two surfaces of the circuit board, a terminal base fixed to one surface of a front portion of the circuit board and having a multiplicity of electrode terminals disposed on its upper surface, a plurality of electronic parts mounted on the two surfaces of the circuit board, and a package in which the circuit board on which the electronic parts are mounted is incorporated while exposing the electrode terminals to the outside of the package.

Growing community of inventors

Itami, Japan

Makoto Omori