Dowa Mining Co., Ltd.

Dowa Metaltech Co., Ltd.

Makoto Namioka

Hideyo Osanai

Takayuki Takahashi

Ken Iyoda

Susumu Ibaragi

Susumu Ibaraki

Masami Kimura

Nobuyoshi Tsukaguchi

Susumu Shimada

Masahiko Wada

Jyunji Nakamura

To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part, a molten metal push-out part, and a cooling part; and a guidefor allowing a mold to pass through these plural process regions, moldshaving ceramic membersplaced therein are successively inserted into a mold inletprovided in this guideto pass through the guidepractically in a shielded state from the atmosphere, a molten metalis poured thereto in the molten-metal push-out part, and the molten metalis cooled and solidified in the cooling partto join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

Apparatus, mold, and method for manufacturing metal-ceramic composite member

The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plateis bonded on a part of a ceramic substrateso as to expose an outer peripheral edge portion of the ceramic substratein an integrally bonded member, the integrally bonded memberis set on a treating apparatuswhile being covered with a masking memberhaving a window portionfrom which the circuit pattern forming metal plateof the integrally bonded memberis exposed. Further, the integrally bonded memberis pressed with an appropriate pressure from a base plateside so that a boundary surface between a portionsurrounding the window portion in the masking member and an exposed surfaceof the ceramic substrate which is exposed in a metal-ceramic bonded memberhas a state not allowing a liquid to pass therethrough. Thereafter, a treatment solutionfor wet treatment is injected from an injection pipeto be in contact with the circuit pattern forming metal plate

Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof

There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrateto be cooled and solidified. Thus, a circuit forming metal platehaving a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate, and a metal base plateis bonded to the other side thereof.

Method for producing metal/ceramic bonding circuit board

There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plateis bonded to one side of a ceramic substrate, and a heat sink plate (metal base plate)is bonded to the other side thereof. On the heat sink plate, a work-hardened layeris formed by shot peening. On the metal circuit plateof the metal/ceramic bonding substrate, semiconductor chips (Si chips)are soldered (solder layer). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer) of the power module, a radiating finis mounted via a thermal greaseby means of screwsor the like.

Metal/ceramic bonding substrate and method for producing same

In a metal/ceramic bonding substratewherein a circuit forming metal plateis bonded to one side of a ceramic substrateand a radiating metal base plateis bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrateto the metal base plateThe difference in level is provided by forming at least one of a rising portionand a groove portionon and in the metal base plate

A manufacturing apparatus capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefor. An apparatus for manufacturing a metal-ceramic composite member has a plurality of process regions, namely, an atmosphere replacing/heating part, a molten metal push-out part, and a cooling part; and a guide for allowing a mold to pass through these plural process regions. The molds have ceramic members placed therein and are successively inserted into a mold inlet provided in the guide to pass through the guide practically in a shielded state from the atmosphere. A molten metal is poured thereto in the molten-metal push-out part, and the molten metal is cooled and solidified in the cooling part to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substratewherein a circuit forming metal plateis bonded to one side of a ceramic substrateand a radiating metal base plateis bonded to the other side thereof, at least part of the ceramic substrateis embedded in the metal base plate. The ceramic substrateis arranged substantially in parallel to the metal base member

An aluminum platehaving a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrateof aluminum nitride or alumina to be heated at a temperature of 620 to 650&#xb0; C. in an inert gas to bond the aluminum platedirectly to the ceramic substrate

Aluminum/ceramic bonding substrate and method for producing same

To provide a mold capable of manufacturing a metal-ceramic composite member in which a predetermined number of ceramic members are joined onto a large joining metal, the large joining metal being free from swell and shrinkage cavity on the surface thereof and high in dimensional precision. A metal-ceramic composite memberaccording to this embodiment is manufactured in such a manner that a predetermined number of metal-ceramic bonded substratesare placed in a mold main bodyconstituting a mold, with a ceramic substrateside thereof facing upward, an atmosphere inside and outside the moldis replaced with an inert gas such as a nitrogen gas from the atmosphere, a molten metalis poured and filled in a first joining portionthat is formed by the molten metal main bodyand an upper containerand that has a shrinkage cavity inducing portionon a metal material holding portion side and a shrinkage cavity inducing portionon an air vent side, and the molten metalis cooled.

Mold and method for manufacturing metal-ceramic composite member

The present invention provides a combined member of aluminum-ceramics. The combined member comprises a ceramic board, a conductive member holding electronic parts thereon, formed on one surface of the ceramic board, and a water cooling jacket of aluminum or aluminum alloy bonded directly on the other surface of the ceramic board.

Combined member of aluminum-ceramics

There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.

Growing community of inventors

Tokyo, Japan

Makoto Namioka