Nitto-Denko Corporation

Makoto Namikawa

Eiji Toyoda

Yoshio Terada

Haruo Ioka

Masayuki Yamamoto

Hirofumi Fujii

Takuji Okeyui

Saburo Miyamoto

Koichi Hashimoto

Yuki Sugo

Jirou Nukaga

Takao Matsushita

Daisuke Uenda

Yasuhiro Amano

Shigeji Kuroda

Seiichiro Shirai

Hitoshi Ishizaka

Youhei Maeno

Satoshi Sakai

Kouichi Hashimoto

Yoshinori Yoshida

Nobuaki Maruoka

Yukari Konda

Toshihiko Onozuka

Asami Funatsu

Seiichirou Shirai

Takayuki Noishiki

Katsuhiro Sasajima

Daisuke c/o Nitto Denko Corporation Uenda

A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180&#xb0; peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Label sheet for cleaning and conveying member having cleaning function

A method for producing an organic EL device includes the steps of: preparing an adhesive sheet on which a resin substrate is laminated, allowing the resin substrate to adhere onto a hard substrate with the adhesive sheet interposed therebetween, forming an organic EL element on the resin substrate, thereby producing an organic EL device including the resin substrate and the organic EL element, and peeling the organic EL device from the hard substrate. The adhesive sheet includes a first adhesive layer for being bonded to the hard substrate, and a second adhesive layer formed on the first adhesive layer and bonded to the resin substrate. A non-adhesive region is defined at an end portion of the resin substrate, the non-adhesive region not overlapping with the second adhesive layer but overlapping with the first adhesive layer when projected in the thickness direction.

Method for producing organic EL device and substrate for producing organic EL device

A cleaning sheet which comprises a porous layer as a cleaning layer; or a cleaning sheet which comprises a sheet material having a porous layer and, formed on one side of the sheet material, an adhesive layer.

Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these

A cleaning sheet comprises a cleaning layer provided on one side of a base material, from which cleaning layer F, Cl, Br, NO, NO, PO, SO, Na, NHand Kare extractable with pure water each in an amount of not greater than 20 ppm, when extracted under boiling at 120&#xb0; C. for 1 hour, and a pressure-sensitive adhesive layer provided on the other side of the base material, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer. The present disclosure also relates to a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment.

Cleaning sheet and method of cleaning substrate processing equipment

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mmas determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them

The invention provides cleaning sheets for use in cleaning, e.g., various substrate-processing apparatus, systems for conveying exposure masks (reticles) in microfabrication, etc., and a method of cleaning these with the cleaning sheets. A cleaning sheet which comprises a sheet material comprising a thermoset resin layer having porosity and, formed on one side of the sheet material, a pressure-sensitive adhesive layer comprising a thermoplastic resin.

Cleaning sheets and method of cleaning with the same

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mmas determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10.

A cleaning sheet which comprises a cleaning layer having a tensile stress at 10% strain of from 0.3 to 3,000 N/mmor a carrying member with a cleaning function wherein at least one side of the carrying member has a cleaning layer having a tensile stress at 10% strain of from 0.3 to 3,000 N/mm, particularly, a cleaning sheet or a carrying member with a cleaning function of the aforementioned constructions, wherein the aforementioned cleaning layer comprises a resin layer having been hardened by an active energy source or a polymer resin having heat resistance.

Cleaning member and cleaning method

A cleaning sheet comprising: a cleaning layer; and a protective film treated with a releasing agent comprising a silicone, the protective film being provided as a separator on at least one side of the cleaning layer, wherein an amount of silicone attached to the cleaning layer when the separator is peeled off from the cleaning layer is 0.005 g/mor less as calculated in terms of polydimethylsiloxane.

Cleaning sheet and process for cleaning substrate treatment device using same

The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20&#xb0; C. up to 150&#xb0; C. being 5&#xd7;10Pa to 1&#xd7;10Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor

A cleaning sheet has a cleaning layer having a surface resistivity not less than 1&times;10 &OHgr;/&square;. In a method of manufacturing a conveying member with a cleaning function, for sticking the cleaning sheet, in which the cleaning layer formed of an adhesive that is polymerized/cured by an active energy is provided onto one surface of a base material and an ordinary adhesive layer is provided onto the other surface thereof, onto the conveying member via an ordinary adhesive layer to have a shape larger than the shape of the conveying member and then cutting the cleaning sheet along a shape of the conveying member, wherein a polymerizing/curing reaction of the cleaning layer is carried out after the cleaning sheet is cut out into the shape of the conveying member.

The present invention provides a method for producing an organic EL device comprising a step of eliminating a partition wall , which has become unnecessary after patterning, from a substrate in a production or an organic electroluminescence device (organic EL device). In particular, it provides a method for producing an organic EL device comprising a step of attaching on the substrate adhesive sheets , in particular, an adhesive sheet having an ultraviolet ray curing type pressure sensitive adhesive layer after the patterning, and peeling off the adhesive sheets. According to the method, an organic EL device substantially not containing a partition wall is provided so that the adverse effect of the moisture content and the gas discharged from the partition wall to the device can be prevented, and thus an organic EL device with a long life can be provided.

Organic electroluminescence device and method for producing the same

A low-staining adhesive sheet provided with an adhesive layer containing as the main component a pressure-sensitive adhesive polymer on a base film, wherein the pressure-sensitive adhesive polymer is substantially free from oligomeric low-molecular weight matters; and a method for removing a resist material by using this low-staining adhesive sheet. This low-staining adhesive sheet gives no organic staining matters remaining on the surface of article (for example, substrate) to be used as an adherend and is useful in removing a resist material and foreign matters, and re-peeling surface-protectors, masking materials, and other materials.

Low-staining adhesive sheets and method for removing resist material

The present invention provides a process for the peeling of a resist material with a pressure-sensitive adhesive sheet which involves the improvement in the removal of resist material or the enhancement of peelability of resist material to certainly remove the resist material from the object regardless of the properties or treated state of the resist material. The process comprises (1) after the application of the pressure-sensitive adhesive sheet, effecting a stress-imparting treatment which causes shrinkage or expansion of the pressure-sensitive adhesive sheet so that a stress develops at the interface between the resist material and the object or (2) prior to the application of the resist material to the object, effecting surface treatment to the object such that the surface of the object has a surface free energy of to not greater than 60 dyne/cm.

Process for the removal of resist material

A process for producing a head slider wherein a floating surface is formed on a slider substrate by photolithography. The process for the production of a head slider has a step of forming, on a slider substrate by photolithography, a patterned floating surface having a resist material on its upper surface; a step of sticking an adhesive sheet on the upper surface of the resist material present on the floating surface; and a step of peeling off the adhesive sheet together with the resist material from the floating surface.

Growing community of inventors

Ibaraki, Japan

Makoto Namikawa