Ngk Spark Plug Company, Limited

Makoto Nagai

Takahiro Hayashi

Seiji Mori

Makoto Wakazono

Tatsuya Ito

Atsushi Uchida

Masahito Morita

Tomohiro Nishida

Hisashi Wakako

Kazuo Kimura

Makoto Origuchi

Hidetoshi Wada

Takeshi Toyoshima

Setsuo Yada

Disclosed is a wiring board on which an optical element is mounted in a state of being sealed by a transparent plate, lens or the like while preventing or reducing the occurrence of condensation or freezing on a surface of the transparent plate, lens or the like. In one embodiment, the wiring board includes: a board body formed with opposed front and back surfaces by stacking of a plurality of ceramic layers (insulating layers); and a plurality of optical element-mounting pads disposed on a bottom surface of a cavity open to the front surface of the board body. The wiring board further includes a heater circuit arranged at the front surface of the board body or an interface of the ceramic layers of the board body along a peripheral side in plan view.

Wiring board for mounting optical element

A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.

Circuit board

To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layerwhere resin insulating layersandand a conductor layerare laminated is formed at a substrate main surfaceside of an organic wiring board. The conductor layerfor an outermost layer in the first buildup layerincludes a plurality of connecting terminal portionsfor flip-chip mounting a semiconductor chip. The plurality of connecting terminal portionsis exposed through an opening portionof a solder resist layer. Each connecting terminal portionincludes a connection regionfor a semiconductor chip and a wiring regiondisposed to extend from the connection regionalong the planar direction. The solder resist layerincludes, within the opening portion, a side-surface covering portionthat covers the side surface of the connecting terminal portionand a projecting wall portionthat is integrally formed with the side-surface covering portionand disposed to project so as to intersect with the connection region

Wiring board and method for manufacturing same

To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.

Wiring board and manufacturing method of the same

A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Wiring substrate and method for producing wiring substrate

A wiring board () having: a board body () including an insulating material and having a front surface (), a back surface (), a cavity () having an opening in the front surface () of the board body () and having a bottom surface () and a side surface (), and a projection which is provided on a front surface side of the side surface () of the cavity and projects toward a center of the opening; a metal layer () provided on the side surface () of the cavity; and an insulating portion which is provided on a back surface () of the projection () so as to define an obtuse angle (&#x3b8;) with the metal layer (), or which covers at least a top end portion of the metal layer ().

Wiring board

A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metalized layer provided along a side face of said cavity and metalized layers provided in said substrate body are provided to continue to each other.

Wiring substrate for mounting light emitting element

A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.

Growing community of inventors

Komaki, Japan

Makoto Nagai