Tdk Corporation

Nec Corporation

Nippon Kayaku Kabushiki Kaisha

Makoto Morita

Kyohei Tonoyama

Shinichi Sato

Tomokazu Ito

Yoshihiro Maeda

Hitoshi Ohkubo

Takashi Kudo

Manabu Ohta

Yuuya Kaname

Fuyuki Miura

Hidemitsu Aoki

Akira Takashima

Hidekazu Sato

Makoto Yoshino

Hideharu Moro

Yoji Tozawa

Akihiko Oide

Isao Fujiwara

Satoshi Kurimoto

Toshiyuki Anbo

Masashi Shimoyasu

Yoshiaki Kitajima

Sumio Takahashi

Takuo Abe

Tsutomu Ono

Masanori Sugai

Takashi Suzuki

Shinichi Kondo

Yasushi Sasaki

Kenji Horino

Yusuke Nagai

Yuji Shimizu

Toshihiko Hayashi

Masahito Furukawa

Hiroshi Kitajima

Kunihiko Kawasaki

Atsushi Shoji

Atsushi Hitomi

Yasunori Chiba

Kazuhiro Ebina

Takahiro Kawahara

Kaori Watanabe

Yoshimi Shiramizu

Kensaku Asakura

Toru Tonogai

Ryuichi Wada

Takaya Ishigaki

Tsukasa Sato

Masatoshi Shindoh

Wataru Takahara

Naoki Uchida

Hirofumi Seo

Yuichi Oyanagi

Yasuhiro Hirobe

Masahiro Yahagi

Kyosuke Inui

Kenichi Horikawa

Masaharu Nakamori

Teruo Taguchi

Masashi Kitazaki

Tadashi Ogasawara

Naoki Satou

Syuuzi Itoh

Nahomi Ohta

Shouichi Iwaya

Arihiro Tomura

Haruto Hamano

Kan Saiga

Masahiro Kato

Keito Yasuda

Hideto Itoh

Takamichi Sato

Setuo Sasaki

Mikio Tsuji

Makoto Iuchi

Eietsu Abe

Masao Asakawa

Minami Kudoh

Junichi Aoyado

Shigeru Itou

Hitoshi Kudou

Hidemitsu Sugihara

Kazuhiro Tokunaka

Yasutada Imamura

Masatoshi Ozawa

In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.

Multilayer coil component

An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.

Electronic component

An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

A coil device includes a coil portion, an element body, and a terminal electrode. The coil portion is formed by a wire wound in a coil shape. The element body contains the coil portion where a part of an outer circumference of a lead-out part of the coil portion is exposed as an exposed portion from a bottom surface of the element body and where the rest of the outer circumference of the lead-out part of the coil portion is embedded as an embedded portion in the element body. The terminal electrode is formed on the bottom surface of the element body and connected with the exposed portion. An embedded length of the outer circumference of the lead-out part in the embedded portion is larger than a substantially half of a full length of the outer circumference of the lead-out part.

Coil device

A coil device includes a conductor and a terminal electrode. The conductor is embedded in a core body and wound in a coil shape. The terminal electrode is formed on an end surface of the core body and connected with a lead end of the conductor. The coil device further includes a dummy conductor embedded in the core body separately from the conductor. An end part of the dummy conductor exposed from the end surface of the core body separately from the lead end is connected with the terminal electrode.

In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 &#x3bc;m) smaller than that (32 &#x3bc;m) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.

Planar coil element and method for producing the same

A coil componentis provided with coil conductorsandand a magnetic metal powder containing resin(and) covering the coil conductorsand. The magnetic metal powder containing resinincludes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 &#x3bc;m or more and 100 &#x3bc;m or less. The third average grain diameter is 2 &#x3bc;m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.

Coil component and magnetic metal powder containing resin used therefor

A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.

Coil component and method for producing same

A monoclonal antibody, wherein the monoclonal antibody specifically binds to a single-chain type IV collagen polypeptide, and wherein the monoclonal antibody is obtained by a hybridoma line of Anti NK-Antigen monoclonal antibody #141 having Accession No: FERM BP-11300.

Anti-single-chain type IV collagen polypeptide antibody, pharmaceutical drug, diagnostic, preventive, or therapeutic drug for tumour containing the antibody

In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG.A and has improved magnetic permeability as compared to a planar coil element shown in FIG.B.

Planar coil element

The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and spiral conductors formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of gap electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the gap electrodes, and a gap protection layer provided on at least one of the upper side and lower side of the gap, the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. The gap protection layer is made of resin including magnetic powder and carbon.

Composite electronic device

A coil component having an easily discernible orientation, and a method of producing such a coil component that facilitates the injection of resin. A coil component includes a core with a winding portion, first and second flanges disposed on either end of the winding portion, and a winding accommodating region defined by the winding portion and the first and second flanges, terminal electrodes disposed on the second flange and a winding wound about the winding portion and connected to the terminal electrodes. An insulating resin is formed over the winding at the winding accommodating region. A marker made from a material the same as the insulating resin is provided at outer peripheral surface of the flanges.

Method of manufacturing a coil component

A coil component having a core including a winding portion, and first and second flanges disposed one on either end of the winding portion, A winding is wound about the winding portion, and first and second terminal electrodes are disposed on the first flange. The first flange has an octagonal shape including a bottom surface, a first peripheral surface, first and third omitted peripheral surfaces disposed one on either side of the first peripheral surface, a second peripheral surface opposing the first peripheral surface, and second and fourth omitted peripheral surfaces disposed one on either side of the second peripheral surface. The first terminal electrode is disposed across the first omitted peripheral surface, a part of the bottom surface in a region connecting the entire first omitted side to the entire third omitted side, and the third omitted peripheral surface. The second terminal electrode is disposed across the second omitted peripheral surface, a part of the bottom surface in a region connecting the entire second omitted side to the entire fourth omitted side, and the fourth omitted peripheral surface. The winding has a first end electrically connected to the first terminal electrode on the first omitted peripheral surface and a second end electrically connected to the second terminal electrode on the second omitted peripheral surface.

Coil component and method and apparatus for producing the same

A coil component having a low profile and being conducive to high-density mounting. The coil component includes a corehaving a coil winding portion, and first and second flanges disposed on either end of the coil winding portion. The second flange is adapted to be mounted on a circuit board, and is configured of a substantially octagonal bottom surface having first and second peripheral surfaces and first through fourth omitted peripheral surfaces. The first terminal electrode is disposed across the first omitted peripheral surface and a part of the bottom surface, and the second terminal electrode is disposed across the second omitted peripheral surface and part of the bottom surface separated from the first terminal electrode. A winding is wound over the coil winding portion and has a first end electrically connected to the first terminal electrode at the first omitted peripheral surface, and a second end electrically connected to the second terminal electrode at the second omitted peripheral surface.

Coil component

Growing community of inventors

Tokyo, Japan

Makoto Morita