Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Makoto Morikawa

Toshifumi Ogata

Kenji Sugiura

Noriyasu Tanimoto

Satoshi Shida

Yasuharu Ueno

Masumi Abe

Ryo Minamihata

Hiroyuki Naito

Nobuyuki Matsui

Yoshihiko Kanayama

Shuichi Hirata

Shinya Marumo

Shinji Kanayama

Akira Yamada

Shozo Minamitani

Takaharu Mae

Nobuhisa Watanabe

Makoto Akita

Akira Mori

Takaari Uemoto

Keiji Nishimoto

Noriaki Yoshida

Shoriki Narita

Katsushi Seki

Hiroyuki Yoshida

Shinichi Kitaoka

Hironori Kobayashi

Takafumi Tsujisawa

Kenji Maruyama

Provided is a light-emitting module, a light source device and a liquid crystal display device in which unevenness in the luminance and color hardly occurs as compared to conventional technology. A light-emitting moduleis structured such that a plurality of element columns, each composed of light-emitting elementsarranged in line, are mounted on a substrate, and each element column is individually sealed by a separate sealing member. The light source device and the liquid crystal device each include the above light-emitting module

Light-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module

A lamp according to the present invention includes: a line portion which blocks a part of light proceeding from a light emitting unit in a direction perpendicular to a tube axis direction; and a raised portion which blocks the light proceeding from the light emitting unit in the direction perpendicular to the tube axis direction that is not blocked by the line portion. The raised portion has an end portion having a linear shape in the tube axis direction, the end portion being an end portion of a section of the raised portion that blocks light.

Lamp and lighting apparatus

Light source of light emitting diode

A phosphor layer forming apparatus () in which a paste () containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements () mounted on a substrate () includes the following: a discharge portion () for discharging the paste () in the form of droplets onto each of the light-emitting elements (); a measurement portion () for measuring the thickness of individual phosphor layers that are formed of the paste () covering each of the light-emitting elements (); and a discharge control portion () for controlling the amount of the paste () to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (). This phosphor layer forming apparatus can reduce the manufacturing time.

Apparatus for forming phosphor layer and method for forming phosphor layer using the apparatus

Substrate for light source of light emitting diode

A light-emitting module () includes a mounting board () with a conductor pattern and a plurality of light-emitting elements () mounted on the conductor pattern via wires (). The extending direction of each of the wires () toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (). This can prevent the shadows of the wires () from overlapping, and thus can suppress the luminance nonuniformity.

Light-emitting module with plural light emitters and conductor pattern

A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

Component mounting method, component mounting apparatus, and ultrasonic bonding head

A component mounting apparatus has a stagewith a fixed height position for holding a substrate, and a mounting headthat releasably holds a component, is moved downward toward the stagefrom a first reference height position HBfixedly positioned above the stage, and mounts the held componenton the substrateor an already mounted component. A controllerhas a mounting reference height calculation unitfor calculating a mounting reference height Hcorresponding to a distance from the first reference height position HB, and a first target movement height calculation unitfor calculating a first target movement height ZTAGbased on at least the mounting reference height Hand a thickness PTof the componentheld by the mounting head. The controllermoves the mounting headholding the componentdownward from the first reference height position HBto the first target movement height ZTAGto mount the held componenton the substrateor the already mounted component

Component mounting apparatus and component mounting method

A suction nozzle () of a reversing head device () has a distal end surface () with a suction hole () opened therein, and a suction passage () communicated with the suction hole () at one end thereof. A portion of the distal end surface () outside of the suction hole () abuts against bumps () of an electronic component (). The suction hole () is opposed with a gap to a portion of a mounting side surface () where no bumps () are present. A vacuum pump () creates an air flow that flows from the gap between the suction hole () and the mounting side surface () into the suction passage () through the suction hole (). The electronic component () is held at the distal end surface () by a negative pressure generated by the air flow.

Component supply head device and component mounting head device

Growing community of inventors

Nara, Japan

Makoto Morikawa