Toshiba Memory Corporation

Kabushiki Kaisha Toshiba

Makoto Minaminaka

Takanobu Ono

Tsutomu Fujita

Ryoji Matsushima

Keisuke Tokubuchi

Akira Tomono

Takeori Maeda

Naoki Iwamasa

Yuuki Kuro

A semiconductor manufacturing apparatus according to an embodiment irradiates a semiconductor substrate with laser to form modified regions along an intended cut line in the semiconductor substrate. A light source emits the laser. An optical system comprises an objective lens configured to focus the laser in the semiconductor substrate. A light modulator is capable of modulating an energy density distribution of the laser. A controller controls the light modulator to displace a peak position of the energy density distribution of the laser from an optical axis of the objective lens in a relative movement direction of the optical system with respect to the semiconductor substrate.

Semiconductor manufacturing apparatus

A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.

Mold

According to one embodiment, a semiconductor device includes a semiconductor element having a substrate with at least two bending portions formed on a first side surface thereof. The two bending portions are displaced from each other in a first direction that is perpendicular to the first side surface of the substrate and parallel to a front surface of the substrate and in a second direction parallel to the front surface of the substrate and perpendicular to a top surface of the substrate. A rearmost portion of the first side surface is substantially perpendicular to the front surface.

Semiconductor device and method of manufacturing the same

A semiconductor chip which is mounted on a wiring substrate and which is electrically connected to the wiring substrate is disposed in a sealing apparatus. A sealing resin material made of a thermosetting resin composition is supplied into the sealing apparatus. The sealing resin material contains a solid foreign matter having a cured product of a thermosetting resin, and includes particulates of the thermosetting resin composition pulverized with the solid foreign matter, a granulation powder of the particulates, or a preform of the particulates. The semiconductor chip is resin sealed by using the sealing resin material.

Growing community of inventors

Suzuka, Japan

Makoto Minaminaka