Fujitsu Corporation

Ubiquitous Entertainment Inc.

Makoto Kondo

Chikashi Anayama

Toshiyuki Tanahashi

Akira Furuya

Hiroshi Sekiguchi

Mami Sugano

Hajime Shoji

Kay Domen

Ryo Shimizu

A card (which is displayed on a screen by the card application and is thus operated, and has a single function) is output to a display of an information processing device through a shell (an OS for controlling card application and a seal application), and a seal (a display associated with an action such as an output) can be placed on a part of the card. The seal placed on the card is written to a seal DB and the seal placed on the card is displayed in accordance with information of the seal DB when the card is to be output. The seal corresponds to a seal application depending on each type. When an object of the card having the seal placed thereon is coincident with a predetermined condition, the corresponding seal application is activated by the shell so that a predetermined action such as a notice or an output of a ring tone is executed.

Information processing program, information processing device and information processing method

A semiconductor laser includes a patterned semiconductor substrate including a lower flat plane portion, an upper flat plane portion, and a stripe-shaped slant plane portion connecting the lower flat plane portion and the upper flat plane portion, an active layer formed on the semiconductor substrate, an upper cladding layer formed on the active layer, current blocking layers formed on portions of the cladding layer, the portions respectively corresponding to the lower flat plane portion to the upper flat plane portion; and a current channel region formed on a portion of the upper cladding layer corresponding to the slant plane portion. There are satisfied relations t1&gt;t2 and tan.sup.-1 (2t1/W).ltoreq..theta.+.phi.&lt;90.degree., where t2 is thickness of the flat plane portions of the upper cladding layer, t1 is thickness of the slant plane portion of the upper cladding layer, .theta. is an angle formed between a boundary between the lower flat plane portion and the slant plane portion and a bottom plane of the lower flat plane portion, .phi. is an angle formed between a bottom plane of the slant plane portion and extension of the bottom plane of the lower flat plane portion, and W is width of the stripe of the slant plane portion of the active layer.

Method for forming semiconductor laser emitting light from slant plane

A technique for manufacturing a semiconductor device includes the steps of preparing a stepped substrate made of a group III-V compound semiconductor and having a flat surface exposing a (1 0 0) plane and a slanted surface exposing an (n 1 1)B plane whrerein n is a real number of about 1.ltoreq.n, and epitaxially growing the group III-V compound semiconductor to form an epitaxial layer on the surface of the stepped substrate while doping p- and n-type impurities, selectively at the same time or, alternatively, under conditions such that the grown epitaxial layer has an n-type region on the slanted surface and a p-type region on the flat surface.

Semiconductor device and its manufacture utilizing crystal orientation

A technique for manufacturing a semiconductor device includes the steps of preparing a stepped substrate made of a group III-V compound semiconductor and having a flat surface exposing a (1 0 0) plane and a slanted surface exposing an (n 1 1)B plane, wherein is a real number of about 1.ltoreq.n, and epitaxially growing the group III-V compounds semiconductor to form an epitaxial layer on the surface of the stepped substrate while doping p- and n-type impurities, selectively at the same time or, alternatively, under conditions such that the grown epitaxial layer has an n-type region on the slanted surface and a p-type region on the flat surface.

Method of making a semiconductor device utilizing crystal orientation

A method for fabricating a laser diode, comprises the steps of: forming a first stripe structure defined by a plurality of crystallographically distinct surfaces on a surface of a semiconductor substrate; forming an epitaxial layer of InGaAlP on the semiconductor substrate including the first stripe structure by a decomposition of gaseous source materials of In, Ga, Al and P; wherein the InGaAlP layer is doped to the p-type by incorporating Mg while growing the InGaAlP by adding a gaseous source material of Mg into said source materials of In, Ga, Al and P such that the InGaAlP layer is doped to the p-type with a substantially uniform carrier concentration level irrespective of the crystal surfaces forming the stripe structure.

Stripe laser diode having an improved efficiency for current confinement

The semiconductor laser of the present invention has an active layer in which the output edge is formed into a V-shape or comprises a striped active layer which is present in a pumped region and whose light output edge is transversely bent.

Semiconductor laser

A method of manufacturing a semiconductor device having a step of growing a plurality of electrically connected p-type group III-V compound semiconductor layers by organo-metallic vapor phase epitaxy. In growing the plurality of p-type group III-V compound semiconductor layers, all or some of the p-type layers are grown by using a Mg organo-metallic compound as a p-type impurity and adding an Al organo-metallic compound of a predetermined amount. Doping both the Mg organo-metallic compound and Al organo-metallic compound at the same time considerably shortens the Mg doping delay.

Magnesium-doping in III-V compound semiconductor

A crystal of a compound semiconductor is deposited on a substrate using a metal organic vapor phase epitaxy within a reaction enclosure having a vertical flow of deposition gas supplied through a gas injector within the deposition enclosure. The deposition gas is supplied in a plurality of divided flow paths in which the flow rates are individually controlled. The injector comprises a plurality of gas jet ports which receive respective, plural flow paths and which are disposed in a two-dimensional array having dimensions corresponding to the two-dimensional main surface dimensions of the substrate thereby to supply a uniform flow of deposition gas over the entire two-dimensional main surface of the substrate. The method and apparatus have special application in the deposition of quaternary III--V compound semiconductor.

Method for depositing compound semiconductor crystal

Magnesium doping in III-V compound semiconductor

A semiconductor laser of a patterned-substrate type comprises the patterned-substrate having a sloped portion and a planar portion, and a plurality of semiconductor layers formed on the patterned-substrate including a heterostructure. By controlling condition for growing a specific semiconductor layer, a preferably ratio of a sloped portion thickness to a planar portion thickness of the semiconductor layer can be obtained, which enables a lasing current of the laser to be confined in a restricted region, and this results in obtaining a high efficiency and a high power output of the semiconductor laser.

Semiconductor laser of patterned-substrate type and structure thereof

A semiconductor laser of a patterned-substrate type comprises the patterned-substrate having a sloped portion and a planar portion, and a plurality of semiconductor layers formed on the patterned-substrate including a heterostructure. By controlling condition for growing a specific semiconductor layer, a preferable ratio of a sloped portion thickness to a planar portion thickness of the semiconductor layer can be obtained, which enables a lasing current of the laser to be confined in a restricted region, and this results in obtaining a high efficiency and a high power output of the semiconductor laser.

Manufacturing method of semiconductor laser of patterned-substrate type

Apparatus for depositing compound semiconductor crystal

A semiconductor laser includes a substrate having a (100) face as its main surface, where the substrate has a stripe of a first mesa extending in a &lt;110&gt; direction of the substrate and including a (111)B face as its sloping surface, a buried layer formed on the substrate excluding a top surface of the stripe of the first mesa so that the (111)B face of the stripe of the first mesa is covered a sloping surface part of the buried layer, where the top surface of the stripe of the first mesa is the (100) face of the substrate and forms a stripe of a second mesa together with the sloping surface of the buried layer and the stripe of the second mesa has a smaller inclination than the stripe of the first mesa, and a double heterostructure made up of a plurality of semiconductor layers and formed on the stripe of the second mesa. The double heterostructure has a substantially trapezoidal cross section which is determined by the stripe of the second mesa.

Growing community of inventors

Kawasaki, Japan

Makoto Kondo