Mitsubishi Denki Kabushiki Kaisha

Makoto Kobayashi

Syojiro Kodai

Katsunori Ochi

Osamu Murakami

Tuguo Kurisu

Akira Yamada

Fumiaki Baba

Tsuguo Kurisu

A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.

Method of making IC card

At least one part of a two-part container of a portable semiconductor device has an electronic part accommodating portion, a foamed resin accommodating portion provided at a peripheral edge portion of the container for accommodating an excess of foamed resin, and a coupling groove for coupling the electronic part accommodating portion to the foamed resin accommodating portion. Since the electronic parts and a circuit board are completely embedded in the device, a semiconductor device exhibiting excellent resistance to environment can be manufactured by a simple process.

Portable semiconductor device with resin

An IC card includes: a circuit board on which functional components are mounted; and a frame covered with a thin plate, the circuit board being disposed in the frame, the inside of the frame being filled with a foamed resin. As a result of the above arrangement, an IC card having a strong resistance to various external forces is produced. Furthermore, because it is possible to incorporate a surface material with a design in an integrally molded device, thus it is also possible to produce an IC card device having an excellent appearance.

IC card including frame with lateral hole for injecting encapsulating

In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

Growing community of inventors

Sanda, Japan

Makoto Kobayashi