Hitachi, Ltd.

Renesas Technology Corp.

Other

Hitachi Cable, Inc.

Ihi Corporation

Hitachi Haramachi Electronics Co., Ltd.

Makoto Kitano

Asao Nishimura

Akihiro Yaguchi

Sueo Kawai

Junichi Saeki

Gen Murakami

Ichiro Anjoh

Kunihiko Nishi

Isamu Yoshida

Kunihiro Tsubosaki

Hiroyoshi Kokaku

Masanori Segawa

Hiroshi Kikuchi

Takashi Yokoyama

Akio Hasebe

Hiroshi Hozoji

Takashi Yamazaki

Kazuyoshi Oshima

Masahiro Ichitani

Aizo Kaneda

Shozo Nakamura

Noriyuki Kinjo

Masatsugu Ogata

Syuuji Eguchi

Ryuji Kohno

Ichiro Anjo

Tetsuro Matsumoto

Nae Yoneda

Tetsuo Kumazawa

Naotaka Tanaka

Shuji Eguchi

Tetsurou Matsumoto

Hideo Miura

Akira Nagai

Shigeo Ohashi

Yoshihiro Kondo

Tsuyoshi Nakagawa

Mamoru Mita

Takashi Naganawa

Rintaro Minamitani

Noriyuki Ashiwake

Naoto Ban

Akihiko Ariga

Michiharu Honda

Ichio Shimizu

Yuji Yoshitomi

Hideki Tanaka

Tatsuya Nagata

Shigeharu Tsunoda

Susumu Kasukabe

Yasuhiro Motoyama

Kunio Matsumoto

Hidetaka Shigi

Yuji Wada

Terutaka Mori

Takayoshi Watanabe

Takeshi Terasaki

Kenichi Otsuka

Shuji Shibuya

Masahiko Ogino

Chuichi Miyazaki

Nobutake Tsuyuno

Makoto Morishima

Norio Okabe

Rie Hattori

Hiromichi Suzuki

Satoshi Nakamura

Yoshishige Endo

Takeshi Harada

Masatoshi Kanamaru

Ryo Haruta

Hiroyuki Ota

Atsushi Hosogane

Teruhisa Akashi

Ryuji Kono

Masachika Masuda

Makoto Hayashi

Ryuichi Saito

Takahiro Daikoku

Hisanori Okamura

Nobuya Koike

Hisashi Tanie

Noboru Baba

Atsushi Kazama

Junichi Arita

Kunio Enomoto

Satoshi Kanno

Yoshihiko Koike

Takashi Fujimura

Mitsuaki Haneda

Kazuhiko Nakagawa

Katsuhiko Hirano

Masahiro Seido

Masahiko Sakamoto

Kazuo Yamazaki

Akio Hoshi

Naozumi Hatada

Toshio Hattori

Toshihiro Yasuhara

Toshio Hatsuda

Some materials desired to acquire mechanical characteristics and fatigue characteristics are difficult to make in a large-size bulk material for a test piece. The invention provides a test jig which includes a primary jig which fixes both sides of a test piece, which is a test object, an upper jig which includes a load portion to load a weight on two places of an upper surface and two places of a lower surface of the primary jig, and a lower jig which includes a load portion to load a weight on two places of the upper surface and two places of the lower surface of the primary jig. The upper surface and the lower surface of the primary jig disposed on both sides of the test piece are on almost the same flat surface.

Test jig and test method

This oil-water separation device includes: a supply port () for oily water; a flow passage that causes oily water (X, X) supplied from the supply port to flow so that a flow component in a horizontal direction is a main flow component; a floated oil recovery port (F) provided above an upper portion of the flow passage and also at a position spaced from a start end of the flow passage; and a settled oil recovery port (T) provided beneath the flow passage. According to the oil-water separation device, it is possible to separate an oil component from oily water that contains an oil component with higher viscosity.

Oil-water separation device and refining device

According to the present invention, there is provided a membrane electrode composite module including a membrane electrode composite formed by sandwiching both surfaces of an electrolyte membrane between gas diffusion electrodes, an anode current collecting plate having fuel flow holes through which fuel flows, and a cathode current collecting plate having oxygen flow holes through which oxygen flows, wherein both surfaces of the membrane electrode composite are sandwiched between the anode current collecting plate and the cathode current collecting plate, the membrane electrode composite module further including films made of a synthetic resin (a first film and a second film) which are a base of the anode current collecting plate and a base of the cathode current collecting plate.

Membrane electrode composite module, fuel cell and electronic equipment, and method of manufacturing the membrane electrode composite module

A display apparatus is disclosed with a vacuum seal member which has a shell structure. The display apparatus includes an anode substrate, a planar cathode substrate forming an electron emitting chamber vacuously sealed between the cathode substrate and the anode substrate, electron sources formed on the cathode substrate, phosphors formed on the anode substrate, and a vacuum seal member forming a pressure balancing chamber on the back of the electron emitting chamber side of the cathode substrate. The vacuum seal member is placed covering the back of the electron emitting chamber side, and has a shell structure for receiving the atmospheric pressure.

Display apparatus with shell-structured vacuum seal

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200&#x2013;250&#xb0; C.).

Circuit tape having adhesive film semiconductor device and a method for manufacturing the same

Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by pressing a testing structure provided with electrically independent projections having a number equal to a number of conductor portions to be tested formed on an area to be tested of a body to be tested to the body to be tested.

Method of manufacturing semiconductor apparatus

A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

Liquid cooling system and personal computer using thereof

A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

Liquid cooling system and personal computer using the same

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the 'Lead-On-Chip' or 'Chip-On-Lead' structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Semiconductor device

A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Semiconductor devices and methods of making the devices

A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

Semiconductor device and lead frame therefor

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250&deg; C.).

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, of the type used in an electronic apparatus that is small and thin in size, or in a personal computer equipped with such a structure therein. The system has a pump of the reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another so as to form a closed loop filled with a cooling liquid. In the system, &Dgr;Vs is equal to or greater than &Dgr;Vp, wherein the inner volume change when the pump emits pulsation therefrom is &Dgr;Vp, the pressure caused by the volume change is P, and the volume change due to the pressure P that occurs in flow passage of the cooling liquid &Dgr;Vp other than within the pump, is &Dgr;Vs.

Growing community of inventors

Tsuchiura, Japan

Makoto Kitano