Ebara Corporation

Namiki Precision Singapore Pte. Ltd.

Namiki Seimitsu Houseki Kabushiki Kaisha

Japan Science and Technology Agency

Adamant Namiki Preccision Jewel Co., Ltd.

Adamant Namiki Precision Jewel Co., Ltd.

Makoto Kashiwagi

Manao Hoshina

Kenichi Kobayashi

Asagi Matsugu

Yu Ishii

Fong-Jie Du

Masayuki Nakanishi

Masahiro Koyama

Tetsuji Togawa

Kenichi Akazawa

Manato Furusawa

Shouta Nakamura

Hiroyuki Kogure

Hiroyuki Tajima

Hiroshi Ikeda

Hozumi Yasuda

Kenya Ito

Hiroyuki Arai

Atsushi Yoshida

Masaya Seki

Takashi Kodama

Takashi Mitsuya

Kohtaro Kawamura

Toyoji Shinohara

Keisuke Uchiyama

Akihiro Yazawa

Kotaro Kawamura

Takahiro Nanjo

Mao Izawa

Hideharu Aoyama

Kazumasa Hosotani

Michiyoshi Yamashita

Junichiro Shiomi

Hirotaka Satori

Khotaro Kawamura

Takashi Koba

Kazuhiro Tajima

Seal for chemical mechanical polishing device

A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.

Substrate holding apparatus, substrate processing apparatus having substrate holding apparatus, and substrate processing method

The disclosed subject matter relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the disclosed subject matter relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head includes an annular elastic member configured to press a polishing tool against the substrate, and a pressing-tool body having a pressing surface configured to press the polishing tool against the substrate via the elastic member, wherein the pressing surface has a first fitting groove in which a first portion of the elastic member fits, the first portion () protrudes from the pressing surface, the elastic member is put on the pressing-tool body () with the elastic member elastically deformed, and the polishing head is configured to press the polishing tool against the substrate by the first portion.

Polishing head and polishing apparatus

To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

Substrate transporter and substrate processing apparatus including substrate transporter

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Polishing apparatus

A workpiece supporting apparatus capable of preventing a surface of a workpiece from drying out while maintaining a suction force when supporting the workpiece with a Bernoulli chuck is disclosed. The workpiece supporting apparatus includes a Bernoulli chuck configured to generate a suction force by emitting a gas; and a liquid ejection member surrounding the Bernoulli chuck and configured to discharge a liquid around the Bernoulli chuck.

Workpiece supporting apparatus and workpiece supporting method

Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ringfor holding a substrate WF includes a base membercoupled to a top ring shaft, an elastic filmthat is mounted to the base memberand forms a pressurization chamberfor pressurizing the substrate WF between the base memberand the elastic film, a substrate suction memberthat includes a porous memberincluding a substrate suction surfacefor suctioning the substrate WF and a pressure reducing portioncommunicating with a pressure reducing unit. The substrate suction memberis held to the elastic film

Top ring for holding a substrate and substrate processing apparatus

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

Substrate processing apparatus and substrate processing method

An elastic member that includes a plurality of pressure chambers is manufactured without using a mold having a complicated shape. According to one embodiment, a laminated membrane used in a substrate holder of a substrate processing apparatus is provided. Such a laminated membrane includes a first sheet material and a second sheet material disposed on the first sheet material. A part of the first sheet material is secured to a part of the second sheet material.

Laminated membrane, substrate holder including laminated membrane, and substrate processing apparatus

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

Polishing apparatus and polishing method

Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.

Provided is a silicon bulk thermoelectric conversion material in which thermoelectric performance is improved by reducing the thermal conductivity as compared with the prior art. In the silicon bulk thermoelectric conversion material, the ZT is greater than 0.2 at room temperature with the elemental silicon. In the silicon bulk thermoelectric conversion material, a plurality of silicon grains have an average of 1 nm or more and 300 nm or less, a first hole have an average of 1 nm or more and 30 nm or less present in the plurality of silicon grains and surfaces of the silicon grains, and a second hole have an average of 100 nm or more and 300 nm or less present between the plurality of silicon grains, wherein the aspect ratio of a crystalline silicon grain is less than 10.

Silicon bulk thermoelectric conversion material

According to one embodiment, there is provided a top ring for holding a substrate. The top ring comprises a substrate supporting surface, a retainer member disposed to surround an outer periphery of the substrate supporting surface, and a retainer guiding device configured to guide the retainer member so as to allow the retainer member to be displaced in a direction perpendicular to the substrate supporting surface, and support the retainer member so as to inhibit the retainer member from being displaced in a direction parallel to and away from the substrate supporting surface. The retainer guiding device is disposed in an inner side of the retainer member surrounding the substrate supporting surface.

To reduce a risk generated at a time of collision of a substrate with a retainer. According to one embodiment, a head for holding a polygonal substrate as a polishing object of a polishing apparatus is provided. The head includes a substrate holding surface configured to hold a substrate and a retainer positioned outside the substrate holding surface. The retainer has an end region. The end region is arranged adjacent to a corner portion of the substrate held onto the head. The end region has an end surface on a side of the substrate holding surface. The end surface is configured to increase in distance from the substrate holding surface with approaching an end portion in a longitudinal direction of the retainer.

Polishing head for holding substrate and substrate processing apparatus

Growing community of inventors

Tokyo, Japan

Makoto Kashiwagi