Sharp Kabushiki Kaisha Corporation

Makoto Kanda

Hirokazu Yoshida

Motoji Shiota

Yasunori Chikawa

Atsushi Ono

Akio Inohara

Satoru Tone

Norimitsu Nie

A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads

Semiconductor device with bumps on electrode pads oriented in given direction

Semiconductor device including bump electrodes

A semiconductor integrated circuit is provided which includes bump electrodes having a uniform height. The semiconductor integrated circuit includes: a semiconductor substrate (wafer) having a plurality of bump electrode formation areas and a bump electrode non-formation area respectively defined on a front surface thereof; a first electrode pad formed in the bump electrode non-formation area; a second electrode pad formed in each bump electrode formation area; and a bump electrode formed on each second electrode pad; wherein the first electrode pad is used for supplying a plating electric current to the second electrode pads through the semiconductor substrate in formation of the bump electrodes by electrolytic plating.

Semiconductor integrated circuit and fabrication process therefor

Growing community of inventors

Kashihara, Japan

Makoto Kanda