Mitsubishi Denki Kabushiki Kaisha

Canon Kabushiki Kaisha

Renesas Technology Corp.

Makoto Kanda

Takahiro Oguchi

Masahiro Tagawa

Masaharu Yoshida

Tomokazu Andoh

Koji Watanabe

Akihiko Yamano

Hiroshi Fukumoto

Kenji Ohgiyama

Yasufumi Nakasu

Daisuke Hirota

Yasunari Shiraishi

Yasunori Hosokawa

Tadashi Mitarai

A method for manufacturing an image display device includes the steps of preparing a plurality of spacers preliminarily, measuring heights of the plurality of spacers prepared by the preparing step individually, and deciding an order of arranging the spacers on the basis of the measured heights obtained in the measuring step. The spacers are arranged in the order decided in the deciding step.

Method for manufacturing image display device, image display device, and TV apparatus

To prevent breakage of a membrane probe during a probe test using a probe card having the membrane probe, appearance of a main surface of a wafer as a test object is tested by an appearance tester, and results of bad appearance such as adhesion of a foreign substance to the main surface of the wafer and abnormality in shape of bump electrodes over the main surface of the wafer are collected as wafer map data according to arrangement of respective chips in a plane of the wafer, then the wafer map data are transmitted to a probe testervia a server, and the probe testeromits the probe test for chips in which bad appearance was detected, and concurrently performs the probe test to other chips in which bad appearance was not detected, based on the wafer map data.

Fabrication method of semiconductor integrated circuit device

A method manufactures an image display device including a rear plate having a plurality of electron emitting devices arranged thereon, a face plate arranged opposite the rear plate, an outer frame arranged between the rear plate and the face plate and supporting peripherals of the rear plate and the face plate, and a plurality of spacers arranged between the face plate and the rear plate. The method includes the steps of preparing the plurality of spacers preliminarily, measuring heights of the plurality of spacers prepared by the preparing step individually, deciding an order of arranging the spacers on the basis of the measured heights obtained in the measuring step, and arranging the spacers in the order decided in the deciding step.

An image display device of a high quality, in which the variation of heights between adjoining spacers is reduced by measuring the heights of spacers to arrange the spacers from the end in the sequential order of heights so that the mechanical precision of the spacers need not be strictly managed.

A small ball is formed at an end of a second gold wire that is held and guided by a second capillary. The small ball has a diameter approximately equal to that of a first gold wire. The small ball is bonded to an electrode on an optical device. The second gold wire is separated from the small ball. A large ball is formed at the lower end of the first gold wire, which is held and guided by a first capillary. The large ball is bonded to a wiring pattern on a external wiring substrate. The first capillary is moved upward, and then moved toward the small ball in the horizontal direction. The first gold wire is connected to the large ball. The first gold wire is bonded to the small ball by stitch bonding, and then separated from the small ball.

Method of manufacturing a device package

A semiconductor laser apparatus includes a base, a block, and a semiconductor laser element. The base has a recess on a main plane thereof. The block is perpendicularly elongating on the main plane. The block is neighboring the recess. The semiconductor laser element is mounted on a side of the block. A first end of the semiconductor element is located on outer side of the recess, and a second end of the semiconductor element is located on inner side of the recess.

Semiconductor laser device

The present application discloses a characteristic adjusting method of executing a step of changing the characteristics of display devices in an image display apparatus. In particular, the present invention discloses a configuration in which target values for changes in characteristics are obtained by reducing the high-frequency components of the spatial distribution of the characteristics of the display devices.

Method of adjusting characteristics of electron source, method of manufacturing electron emission device

A bump forming apparatus includes a first tank storing fused solder, a cavity having an inlet for the fused solder, a nozzle arranged on a lower portion of the cavity, a pressure element formed by a diaphragm and a piezoelectric element, and a first heater heating the first tank, a pipe and the cavity. The bump forming apparatus further comprises a static pressure control part having a second tank storing solid solder, a second heater provided around a second opening, a level detector detecting the surface level of the fused solder in the first tank and a level control part controlling driving of the second heater on the basis of a detection signal from the level detector. Thus obtained are a bump forming apparatus and a bump forming method capable of properly avoiding defective discharge, increasing the speed of discharge, avoiding dispersion of an amount of discharge and stabilizing discharge.

Bump forming apparatus and bump forming method

A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7). The laser heating means (9) irradiates laser light (9a) through the atmosphere cover (1) to bonding agent (8) applied between a junction (6a) of the lead terminal (6) of the semiconductor device (5 ) and the junction (7a) of the printed circuit board (7), and heats and fuses the bonding agent (8) to bond both the junctions without touching the junctions thereof. Also, inside the atmosphere cover (1), atmosphere gas supplying means (1d), (1e), (1f) and (1g) are provided for supplying atmosphere gas, (4) which is employed for preventing oxidation in the bonding.

Laser bonding apparatus

A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7). The laser heating means (9) irradiates laser light (9a) through the atmosphere cover (1) to bonding agent (8) applied between a junction (6a) of the lead terminal (6) of the semiconductor device (5 ) and the junction (7a) of the printed circuit board (7), and heats and fuses the bonding agent (8) to bond both the junctions without touching the junctions thereof. Also, inside the atmosphere cover (1), atmosphere gas supplying means (1d), (1e), (1f) and (1g) are provided for supplying atmosphere gas (4) which is employed for preventing oxidation in the bonding.

A plurality of semiconductor chips are sequentially mounted on a rotary table, heated on the rotary table for a predetermined time, and ejected from the rotary table. The semiconductor chips ejected from the rotary table are fed to a bonding apparatus. The semiconductor chips are heated while the rotary table is stationary and are held to the rotary table by a vacuum chuck. The position of a semiconductor chip is adjusted before the semiconductor chip is ejected from the rotary table.

Growing community of inventors

Tokyo, Japan

Makoto Kanda