Hitachi Chemical Company, Ltd.

Other

National Institute of Advanced Industrial Science and Technology

Makoto Kaji

Hideo Hagiwara

Yasunori Kojima

Haruhiko Kikkawa

Masataka Nunomura

Akihiro Sasaki

Mitsumasa Kojima

Toshiki Hagiwara

Noriyoshi Arai

Nobuyuki Hayashi

Hiroshi Nishizawa

Kenji Suzuki

Jun Tanaka

Masahiko Ogino

Brian C Auman

Fumio Kataoka

Hiroshi Matsutani

Koichi Abe

Issei Takemoto

Keiko Isoda

Hanako Yori

Shunichiro Uchimura

Yuko Uchimaru

Minoru Sugiura

Futami Kaneko

S Peter Pappas

Matthew L Marrocco, Iii

Hiroshi Suzuki

Atsushi Kakuta

Shigeki Katogi

Hiroyuki Kagawa

Masahiro Miyasaka

Takahiro Hidaka

Takashi Kumaki

Hidetaka Satou

Ken Sawabe

Toshiki Ito

Yasuhisa Ichihashi

Keiichiro Ogawa

Hideyuki Nakayama

Kikujiro Ishii

Masaichi Sagawa

Chie Odoi

Dai Kawasaki

Tomonori Minegishi

Interlayer insulating films(insulating films) provided in a memory capacitor cellare formed between a gate electrodeand a counter electrodeC formed on a silicon wafer. The interlayer insulating filmscomprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1&#xd7;10A/cm.

Borazine-based resin, process for its production, borazine-based resin composition, insulating film and method for its formation

A photocurable resin composition containing a photopolymerization initiator and a (meth)acrylate monomer and/or oligomer, said (meth)acrylate monomer or oligomer having a cyclic structure, in which the atomic weight of carbon (Mcr) in said cyclic structure and the number of whole carbon atoms (MTOT) in said composition have the relation of Mcr/MTOT&#x3e;0.1, or the total number (N) of carbon atoms in said cyclic structure, the total number of carbon atoms (Nc) in said composition and the total number of oxygen atoms (No) have the relation of N/(Nc&#x2212;No)&#x3c;4, and the composition has a kinetic viscosity of 10 mPa&#xb7;s or below. This low-viscosity photocurable resin composition has excellent dry etching resistance and is applicable to optical nanoprinting.

Photocurable resin composition and a method for forming a pattern

Provided is a new photo-curable resin composition which can be used in a photo nanoimprinting technology available for a photo nanoimprinting technology by which a substrate is processed with high accuracy. The photo-curable resin composition contains a photo-curable resin material essentially containing a (meth)acrylate, a reactive diluent, and a photo initiator. Preferably, the (meth)acrylate has a structure containing a benzene ring structure in its skeleton.

Photo-curable resin composition and a method for forming a pattern using the same

Interlayer insulating films(insulating films) provided in a memory capacitor cellare formed between a gate electrodeand a counter electrodeC formed on a silicon waferThe interlayer insulating filmscomprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1&#xd7;10A/cm.

Borazine-based resin, and method for production thereof, borazine based resin composition, insulating coating and method for formation thereof, and electronic parts having the insulating coating

The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, 

Photosensitive element, resist pattern formation method and printed wiring board production method

There are disclosed a photosensitive resin composition which comprises  and Rrepresents a divalent organic group, and

Pattern-forming process using photosensitive resin composition

A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

Photosensitive resin composition, patterning method, and electronic components

Method of preparing photosensitive resin composition

Hexaaryl biimidazole compounds as photoinitiators, photosensitive composition and method of manufacturing patterns using the compounds

Positive photosensitive resin composition, process for producing pattern and electronic parts

A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 &mgr;m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 &mgr;m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.

A 6,6&prime;-dialkyl-3,3&prime;4,4&prime;-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern

Photosensitive resin composition

A polyimide precursor having repeating units of the formula:

Photosensitive polyimide precursor and its use for pattern formation

Polyimide precursor, polyimide and their use

There is disclosed a positive type photosensitive resin composition which comprises an alkali-soluble polymer (A) having a carboxyl group and/or a phenolic hydroxyl group, and a compound (B) which forms an amine compound with irradiation of light.

Positive type photosensitive resin composition containing an alkali-soluble polymer and a compound which forms an amine compound with irradiation of light

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Hitachi, Japan

Makoto Kaji