Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Makoto Isozaki

Seiichi Takahashi

Rikihiro Maruyama

Akira Iso

Kenshi Kai

A semiconductor device, including an insulated circuit substrate that has a base plate, a resin layer disposed on a front surface of the base plate, and a circuit pattern disposed on a front surface of the resin layer; and a semiconductor chip that is rectangular in a plan view of the semiconductor device and is bonded to a front surface of the circuit pattern in such a manner that a side edge of the semiconductor chip is spaced inwardly from an outer peripheral edge of the circuit pattern by at least a predetermined distance. Both the predetermined distance and a thickness of the circuit pattern are greater than or equal to 0.1 of a length of one side of the semiconductor chip.

Semiconductor device

A semiconductor module circuit structure, including an insulating circuit substrate having an insulating plate, and a circuit pattern formed on a top face of the insulating plate, and a semiconductor element disposed on a top face of the circuit pattern. The circuit pattern includes a first straight part extending in a first direction, a second straight part extending in a second direction different from the first direction, and a corner part connecting the first and second straight parts. A wiring member is formed on a top surface of the first straight part along the first direction, the wiring member being formed off-center at the first straight part to be closer to an outer periphery of the circuit pattern.

Semiconductor module circuit structure

A semiconductor device, including a substrate having an insulating plate and a conductive plate formed on the insulating plate, a semiconductor chip formed on the conductive plate, a contact part arranged on the conductive plate with a bonding member therebetween, a rod-shaped external connection terminal having a lower end portion thereof fitted into the contact part, and a lid plate having a front surface and a back surface facing the substrate. An insertion hole pierces the lid plate, forming an entrance and exit respectively on the back and front surfaces of the lid plate. The external connection terminal is inserted in the insertion hole. The semiconductor device has at least one of a guide portion with an inclined surface, fixed to a portion of the external connection terminal located in the insertion hole, or an inclined inner wall of the insertion hole.

Semiconductor device and semiconductor device manufacturing method

A semiconductor device, including a first conductive portion including a first conducting region and a first wiring region communicating with the first conducting region via a first communicating portion, a second conductive portion including a second conducting region and a second wiring region that communicates with the second conducting region via a second communicating portion and that faces the first wiring region with a prescribed space therebetween, and a wiring member electrically connecting the first wiring region and the second wiring region in a wiring direction. The first communicating portion and the second communicating portion are separate from each other when viewed from the wiring direction.

A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted into a main body tube portion of the tubular contact member. The tubular contact member includes a protrusion that protrudes inwardly from an inner wall of the main body tube portion. The protrusion is disposed along the entire perimeter of inner wall toward the first open end. The protrusion has a thickness deformation of the protrusion by a load applied thereto when the external electrode terminal is pressed into the main body tube portion. The protrusion is disposed at a height that can block solder that climbs the inner wall of the main body tube portion, to form a gap between the protrusion and a lower end of the external electrode terminal inserted to a predetermined depth of the main body tube portion.

Semiconductor device, metal member, and method of manufacturing semiconductor device

A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module includes a cylindrical portion; a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion and having a diameter larger than an external diameter of the cylindrical portion. An end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange. The cylindrical portion includes a cut-out portion at an inner side of a lower end thereof.

Contact component and semiconductor module

A method of manufacturing a magnetic recording medium that exhibits high performance and high reliability includes forming a liquid lubricant layer capable of high coverage while retaining a film thickness of 1 nm to 2 nm. The magnetic recording medium includes an underlayer, a magnetic layer, a protective layer, and a liquid lubricant layer sequentially laminated or formed on a substrate. The liquid lubricant layer is formed by coating a liquid lubricant diluted with a solvent on the protective layer to a thickness of at least the surface roughness to form a thick film liquid lubricant layer, pressing a slide member against the surface of the liquid lubricant layer while rotating the medium to adhere the liquid lubricant onto the protective layer, and reducing the thickness of the liquid lubricant layer with a solvent that can dissolve the liquid lubricant to the medium surface.

Method of manufacturing a magnetic recording medium and the magnetic recording medium formed thereby

A magnetic recording medium using a plastic substrate as a non-magnetic substrate includes an adhesive layer that prevents film expansion even under severe conditions. The adhesive layer has a chemical affinity to the plastic substrate and is formed on the surface of the plastic substrate, and an underlayer and subsequent layers are formed over the adhesive layer. A polymerized carbon film is used as the adhesive layer.

Magnetic recording medium, method of manufacturing the same and magnetic recording apparatus

A magnetic recording medium and a manufacturing method for making it are disclosed. The method facilitates preventing the lubricant deposited on the end face of the magnetic recording medium from migrating onto the major surfaces thereof. The lubricant deposited on an end face of a magnetic disk, which may migrate onto the major surfaces of the magnetic disk, is wiped off by the rotating magnetic disk with the lubricant deposited thereon, by spraying a solvent onto a wiping tape while feeding the wiping tape, and by pressing the wet wiping tape containing the solvent to the end face of the magnetic disk with a pad while the feeding of the wiping tape is discontinued. Alternatively, the lubricant deposited on the end face of a magnetic disk is solidified to deprive the lubricant of its fluidity by rotating the magnetic disk with the lubricant deposited thereon while irradiating it with ultraviolet radiation from a UV lamp through a slit opened in a shield on the lamp to the end face of the magnetic disk.

Magnetic recording medium and the method of manufacturing the same

A lubricating layer is applied to the surface of a thin protective layer on a magnetic recording medium. The surface of the protective layer is burnished to reduce protuberances. The lubricating layer is removed by solvent washing. Then, a replacement lubricating layer is deposited on the surface of the protective layer. The resulting surface of the magnetic recording medium exhibits reduced scratching and particle contamination.

Growing community of inventors

Nagano, Japan

Makoto Isozaki