Toyoda Gosei Co., Ltd.

Makoto Ishida

Shigeo Takeda

Mitsushi Terakami

Shota Yamamori

Motoyuki Tanaka

Yosuke Tsuchiya

Aya Kawaoka

Yuhki Ito

Toshiaki Mori

Akiko Kimura

A side view type surface mounted light-emitting device includes a submount substrate that includes a mounting surface on one side surface and end through-holes formed at both edges of the mounting surface, a light-emitting element mounted on the submount substrate, first and second flat terminals formed on the mounting surface, and first and second through-hole terminals respectively formed on inner surfaces of the end through-holes at both edges of the mounting surface. At least one of the first flat terminal and the first through-hole terminal is electrically connected to one of n-side and p-side electrodes of the light-emitting element, and at least one of the second flat terminal and the second through-hole terminal is electrically connected to the other of the n-side and p-side electrodes of the light-emitting element.

Light-emitting device

A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.

Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer

A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted 'T' shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Light source and method of mounting light-emitting device

Light emitting diode

A method of manufacturing a light-emitting device includes placing a phosphor-containing film on a mold for compression molding, the mold having a concave portion of a predetermined shape and the film being placed along an inner wall of the concave portion, supplying a resin material on the phosphor-containing film in the concave portion, immersing a light-emitting element mounted on a substrate in the resin material in the concave portion, and applying pressure and heat to the resin material and the phosphor-containing film, thereby forming a transparent sealing resin for sealing the light-emitting element and a phosphor-containing layer covering a surface thereof.

Light-emitting device and method of manufacturing the same

A manufacturing method of light emitting devices, comprises a substrate-forming step of forming a planar-shaped substrate, a frame-forming step of forming a closed frame on the substrate, an element-mounting step of mounting multiple light emitting elements in an inside of the frame, a sealing step of injecting a liquid material that is to be a sealing member to the inside of the frame so as to seal the multiple light emitting elements, and a dividing step of dividing the multiple light emitting elements together with the substrate and the sealing member so as to obtain multiple light emitting devices with the sealing member exposed from a side surface thereof.

Manufacturing method of light emitting devices

A light-emitting device includes an element mounting substrate, a light-emitting element on the element mounting substrate, a case formed around the light-emitting element and having an opening on a light extraction side of the light-emitting device, and a sealing material filled in the opening of the case to seal the light-emitting element. The element mounting substrate includes an uneven portion configured to firmly attach the element mounting substrate to the case or the sealing material.

A method of manufacturing a light-emitting device includes providing a plate-shaped substrate, forming a lattice frame on a light-emitting element mounting surface of the plate-shaped substrate, mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface, sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame, and cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall.

Growing community of inventors

Kiyosu, Japan

Makoto Ishida