Murata Manufacturing Co., Ltd.

Makoto Irie

Motoyuki Okeshi

Takashi Hashimoto

Michinobu Maesaka

Koichi Nitta

Satoru Hachinohe

Yasuo Otowaki

Takashi Iwamoto

Choichiro Fujii

Hidemasa Iwami

Hiroyuki Kawakami

Ken Taniguchi

Atsushi Hirakawa

Jyunji Oyama

Hiroaki Kaida

Toshihiko Unami

Tetsuo Takeshima

Yoshihiro Ikeda

Motonori Matsushita

Tetsuya Morimura

A method of manufacturing a piezoelectric resonator includes forming first electrodes larger than vibrating electrodes in an area Dincluding the vibrating electrodes on obverse and reverse surfaces of a piezoelectric substrate, and measuring the resonant frequency frof a resonator including the first electrodes. The thickness of a metallic thin film required for frequency adjustment is determined based on the measured resonant frequency. Then, second electrodes formed of the metallic thin film having the determined thickness are formed in an area Dincluding at least the vibrating electrodes of the piezoelectric substrate. By removing unnecessary portions of the first and second electrodes, a pattern of the resulting vibrating electrodes is formed. Thus, high-accuracy frequency adjustment can be achieved without the need for complicated positioning.

Method for manufacturing piezoelectric resonator

An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element. Input and output lead terminals are connected to the electrodes on the substrate, while a grounding lead terminal is connected to the cap.

Method of making an electronic component

A piezoelectric component prevents development of a short circuit between separate electrodes of a piezoelectric element and provides a high level of connection reliability. The piezoelectric component includes a piezoelectric element utilizing a longitudinal oscillation mode and being mounted on a mounting substrate. The piezoelectric element has on one main surface thereof a first electrode and a second electrode formed by dividing electrode material via longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate. The support members are adhered to and secured to pattern electrodes of the mounting substrate by conductive adhesive.

Method of producing piezoelectric component

A piezoelectric element prevents the development of a short circuit between separate electrodes and provides a high level of connection reliability. The piezoelectric element utilizing a longitudinal oscillation mode includes a piezoelectric substrate which has on one main surface thereof a first electrode and a second electrode separated by longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate.

Method of producing a piezoelectric element

Method of producing electronic component

A piezoelectric component includes a substrate on which a piezoelectric resonator is mounted with supporting members interposed therebetween. The substrate is covered by a cap which is arranged to cover the piezoelectric resonator. A rubber-like elastic material such as a silicone resin is injected through a hole of the cap to cover the periphery of the piezoelectric resonator. Preferably, the Young's modulus of the rubber-like elastic material is not larger than about 12 kgf/cm.sup.2.

Piezoelectric component

An electronic component which functions as a discriminator includes a piezoelectric resonator having a substrate. First and second pattern electrodes are provided on a first major surface of the substrate. First and second support members made from an electrically conductive material are provided on external electrodes provided on one side surface of a piezoelectric resonator. One end of the first support member is electrically connected to a land of the first pattern electrode via electrically conductive paste and the other end of the first support member is mechanically connected to an insulating member disposed on the substrate. One end of the second support member is electrically connected to a land of the second pattern electrode via electrically conductive paste and the other end of the second support member is mechanically connected to another insulating member disposed on the substrate.

Electronic component and ladder filter with electrically conductive and

A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

Sealing structure and method of sealing electronic component

Piezoelectric component and method of producing same

A piezo-resonator included in a filter and/or an AM signal receiving circuit eliminates unwanted signals produced as a result of the piezo-resonator experiencing a mechanical impact. The piezo-resonator includes a piezoelectric substrate and first and second electrodes provided on opposite surfaces of the substrate. The first electrode is divided into three portions along its width by grooves extending along the longitudinal substrate. The grooves are formed so that the resulting divided portions are substantially symmetrical to each other with respect to the central axis extending along the longitudinal substrate. The peripheral portions of the divided electrode are used as one input/output terminal, while the central portion is used as the other input/output terminal. The piezo-resonator can be provided in at least the last stage of a plurality of resonators for use in a filter. Further, such piezo-resonators or filter can be used in an intermediate frequency filter contained in an AM signal receiving device.

Piezo-resonator, filter and AM receiving circuitry using piezo-resonator

Electronic component and method of producing same

Piezoelectric element and method of producing same

A piezoelectric resonator adapted for use in the band from several hundreds of kilohertz to 2 MHz utilizes a newly discovered width vibration mode and permits use of a simplified support structure which reduces stress on the resonator and reduces the overall size of the resonator. The resonator has a substantially rectangular cross-sectional shape having a pair of shorter sides and a pair of longer sides. To achieve the newly discovered vibration mode, the ratio of the length b of the longer sides to the length a of the shorter sides is set to be within +10% of a value given by

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Toyama, Japan

Makoto Irie