Lintec Corporation

Japan Oil, Gas and Metals National Corporation

Makoto Inoue

Tatsuya Tsukida

Taro Yajima

Junichi Otsuki

An image processing apparatus comprises an acquiring section that acquires DEM data indicating digital elevation of each lattice-shaped area in a predetermined map region, a selecting section that selects at least one of a plurality of line filters that filters data which is continuous in one direction in the map region and a plurality of matrix filters that filters data constituting a two-dimensional region in the map region, a filter processing section that conducts filter processing of the DEM data acquired by the acquiring section by a filter selected by the selecting section, and an outputting section that outputs the DEM data after being filtered in the filter processing.

Image processing apparatus for DEM data and method of image processing for DEM data

There is disclosed an overlaminating adhesive film comprising a transparent film, an adhesive layer and a release material successively laminated in this order, wherein said release material has a surface contacting with the adhesive layer, said surface having a centerline average surface roughness of 0.5 &#x3bc;m or lower; an adhesive forming said adhesive layer has a pH of 7.2 to 8.5 in a solution state before applied, and is an acrylic emulsion-type adhesive having an average particle size of 200 nm or smaller; and a monomer component used for production of said adhesive includes an alkoxysilane group-containing unsaturated monomer in which each alkoxy group has 1 to 4 carbon atoms, but includes no hydroxy-containing unsaturated monomer. The overlaminating adhesive film of the present invention exhibits a good water resistance and is free from deterioration in its transparency due to lifting or bubbles when laminated on an adherend.

Pressure sensitive adhesive film overlamination

A release process film which comprises a base material film and an adhesive layer disposed on one face of the base material film and is used by attaching to a flexible printed circuit board, wherein the adhesive layer is formed with an adhesive comprising an acrylate-based copolymer at least comprising 40 to 99% by mass of a butyl acrylate unit and 1 to 20% by mass of a monomer unit having a crosslinking functional group and a crosslinking agent and the film has specific properties. The film can effectively suppress contamination of the surface of a printed circuit board with solvents and foreign substances and formation of flaws on the surface in the process using the flexible printed circuit board for producing electronic and electric instruments.

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Saitama, Japan

Makoto Inoue