Matsushita Electric Industrial Co., Ltd.

Makoto Imanishi

Shinji Kanayama

Takaharu Mae

Shoriki Narita

Takahiro Yonezawa

Koichi Yoshida

Akihiro Yamamoto

Kazushi Higashi

Nobuhisa Watanabe

Masahiko Ikeya

Akira Kabeshita

Satoshi Shida

Osamu Nakao

Shinzo Eguchi

Hiroshi Wada

Hiroyuki Otani

Kenji Fukumoto

Kohei Enchi

Kouji Hirotani

Kenji Takahashi

Makoto Morita

Yoshifumi Kitayama

Mikio Hasegawa

Koichi Kumagai

Katsuhiko Watanabe

Hiroshi Nasu

Masaru Nagaike

Yoshinori Wada

Ken Kobayashi

Ryoichiro Katano

Richard Gueler

A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.

Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

A preheat device () is provided to execute, before forming bumps () to electrode parts (), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage () through controlling the heating by a controller ().

Apparatus and method for forming bump

In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.

Electronic component mounting apparatus and electronic component mounting method

Device and method for forming bump

Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor

Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.

Working method for holding a work object by suction

Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Bump bonding apparatus and method

A method of mounting an electronic component at a specified position of an object. The method includes applying a sealant beforehand in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then, without obstructing successive bonding of electrodes of the electronic component and the object, the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component because of the air bubbles can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

Method for mounting electronic components and apparatus and dispenser used in the method

To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate having a side for positioning the electronic part, a plate having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring for applying a regulating force to the regulating plate in order to press the electronic part to the plate

Bump bonding device and bump bonding method

An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

An IC chip (,) can be provided to a pre-mount process while being held on a tape-shaped supporting member (,), without being taken out of the tape-shaped supporting member (,).

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage,for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate,having a side for positioning the electronic part, a plate,having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring,for applying a regulating force to the regulating plate in order to press the electronic part to the plate

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Neyagawa, Japan

Makoto Imanishi