Fujitsu Corporation

Fujitsu Semiconductor Limited

Kawasaki Electric Wire Co., Ltd.

Makoto Iijima

Masataka Mizukoshi

Toshio Hamano

Masashi Takenaka

Masaharu Minamizawa

Tetsushi Wakabayashi

Taturou Yamashita

Muneharu Morioka

Seiji Ueno

Masaru Nukiwa

Shozo Fujita

Takafumi Hashitani

Koji Asano

Atsushi Kikuchi

Yoshihiko Ikemoto

Osamu Igawa

Yoshiyuki Kimura

Takao Akai

A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.

Semiconductor device

A method for manufacturing a substrate, including adhering an adhesive layer to an organic insulation substrate to form a first part; forming a via hole in the first part such that the via hole penetrates the first part; forming a conductive metal film so that the conductive metal film covers the via-hole on one side of the first part; using an electrolytic plating process, where the conductive metal Film is used as an electrode, to form a metal via member within the via hole and to form an inter-layer wire; and removing an entirety of the conductive metal film without removing the inter-layer formed by the electrolytic plating process; repeating steps (a)-(e) for a second part; and thereafter attaching the first part to the second part.

Method of forming an insulative substrate having conductive filled vias

A multilayer wiring substrate includes differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.

Multilayer wiring substrate having differential signal wires and a general signal wire in different planes

A semiconductor device includes a semiconductor element on which a plurality of bumps are formed and a substrate having a first surface on which a plurality of protruding electrodes are protrudingly formed in correspondence to an arrangement of the bumps, and a second surface on which balls serving as mounting terminals are formed. The semiconductor element is bonded in a face-down manner to the substrate with the protruding electrodes being embedded into the bumps. Alloy layers having materials identical to those of the bumps and the protruding electrodes are formed on interfaces of the bumps and the protruding electrodes.

Semiconductor device and method of producing the same

A semiconductor device includes a multi-flexible substrate and semiconductor chips mounted thereon. The multi-flexible substrate is configured such that organic insulation substrate layers and filmy adhesive layers are alternatively stacked together and wiring layers formed therein are interconnected by means of vias. Each of the vias consisting of a via-hole which is formed penetrating both the organic insulation substrate layers and the filmy adhesive layers and a metal via member which is provided in the via-hole and made of an identical material. A method of manufacturing the multi-flexible substrate for the semiconductor device is also disclosed.

Semiconductor device and method for manufacturing substrate of the same

A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Semiconductor device and method of forming the same

A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

Method of forming an assembly board with insulator filled through holes

Semiconductor device and assembly board having through-holes filled with

A GMR magnetic sensor includes a lower electrode, a first non-magnetic metal layer formed on the lower electrode and including ferromagnetic regions, a second non-magnetic metal layer on the first non-magnetic metal layer, a third non-magnetic metal layer on the second non-magnetic metal layer and including ferromagnetic regions, and an upper electrode formed on the third non-magnetic metal layer, wherein a tunneling insulation film is disposed further between the first non-magnetic metal layer and the third non-magnetic metal layer.

GMR magnetic sensor having an improved sensitivity of magnetic detection

A biodegradable resin molded article molded from a kneaded material obtained by kneading, melting or mixing a biodegradable resin raw material and at least one of a biodegradable additive and an additive made of a substance existing in the nature, an injection molded article of a biodegradable resin containing a biodegradable resin and an anti-biotic substance, a molded article of a resin composition including a polymer material having an ester bond in the polymer main chain thereof and an alkali or acid component in an amount effective for neutralizing an acidic or alkaline component contained in the polymer material, and a resin molded article having a layer of a biodegradable resin, and a layer of a photolytic resin covering the resin layer and containing an antibiotic.

Biodegradable resin molded article

A semiconductor device includes a board base having through-holes filled with a filling core, and an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths. The semiconductor device further includes a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a passage restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

The invention is directed to a power plug which has a high physical strength against traction forces tending to pull the blades out of the plug body. The power plug of the invention realizes the above characteristics by comprising a pair of blades, each of the blades having one end connected to a cord, and a blade retaining member. The blade retaining member is made of an electrically insulating material, and has retaining portions which retain the blades so that they are not displaced relative to the blade retaining member. A resin molded plug body embeds the blade retaining member, proximal end portions of the pair of blades at which the blades are connected to the cord, and an end portion of the cord to which the blades are connected.

Growing community of inventors

Kawasaki, Japan

Makoto Iijima