Nippon Carbide Industries Co., Inc.

Stanley Electric Co., Ltd

Mitsubishi Paper Mills Limited

Nippon Carbide Kogyo Kabushiki Kaisha

Makoto Ida

Dai Aoki

Shigehiro Kawaura

Yoshiaki Teraishi

Takahisa Kato

Shigetoshi Hiraishi

Keiichi Kishimoto

Shoji Hizatate

Hidetaka Tsukada

Kiichiro Wakamatsu

Fumio Ishida

Takuya Yamashita

Katsuya Shito

A frame body surrounding a perimeter of each light-emitting element is provided one surface of a substrate. Glass films having apertures are formed on the substrate by glass printing to form the frame body.

Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same

A light-emitting device includes a substrate, a plurality of light-emitting elements mounted on one surface of the substrate, a first glass film provided to one surface of the substrate and having a plurality of apertures that form a light-reflecting frame surrounding the perimeter of each the light-emitting elements, and a second glass film provided to the other surface of the substrate. A coefficient of thermal expansion of the second glass film is greater than that of the substrate when a coefficient of thermal expansion of the first glass film is greater than that of the substrate, and a coefficient of thermal expansion of the second glass film is less than that of the substrate when a coefficient of thermal expansion of the first glass film is less than that of the substrate.

Light-emitting device

To provide a package for light emitting element accommodation that realizes enhanced reflectance without application of a metal plating onto a ceramic. There is provided a package for light emitting element accommodation comprising ceramic substrate () having conductor mounting region () for mounting of light emitting element () on its upper surface; frame () of a light reflecting material containing 74.6 mass % or more of alumina whose average particle diameter after sintering is 2.5 &#x3bc;m or less, the frame () disposed on an upper surface of the substrate () in such a fashion that internal circumferential surface () of through-hole () expands outward; and light emitting element () mounted on the conductor mounting region () of the substrate (). Thus, the reflectance of the frame () is enhanced without application of a metal plating thereonto.

Package for light emitting element accommodation containing a substrate and a frame body, the frame body containing alumina and barium

An alumina ceramic contains a BaAlSiOphase. The alumina ceramic has high reflectivity and is useful as a reflecting material for a light emitting element. The alumina ceramic which exhibits an X-ray diffraction pattern having a ratio of the peak intensity at 2&#x3b8;=43.3&#xb0; to that at 22.5&#xb0; of 0.5 to 2.5 has particularly high reflectivity. The alumina ceramic shows high reflectivity particularly at wavelengths ranging from 300 to 400 nm.

Alumina ceramic

Disclosed is a heat-sensitive recording material having excellent properties such as high color-forming sensitivity (excellent thermal response), a high formed color density, freedom from ground fogging and excellent retainability of recorded image. The heat-sensitive recording material has a heat-sensitive recording layer containing (1) at least two diphenylsulfone derivatives, (2) a combination of a diphenylsulfone derivative with a hydroxybenzoic acid derivative, (3) a combination of a diphenylsulfone derivative with a diphenyl ether derivative, (4) a combination of a diphenylsulfone derivative with salicylamide or a derivative thereof, or (5) a combination of 4,4'-dihydroxydiphenylsulfone, salicylanilide and dibenzyloxalate.

Heat-sensitive recording material

Growing community of inventors

Tokyo, Japan

Makoto Ida