Sumitomo Bakelite Company Limited

Promerus, Lcc

Makoto Horii

Edmund Elce

Brian F Knapp

Keitaro Seto

Kazuyoshi Fujita

Cheryl Burns

Hiromichi Sugiyama

Wataru Takada

Sakiko Suzuki

Ryuji Hirosawa

A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyamide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl group (provided that N-methyl-2-pyrrolidone is excluded), and the amount of the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.

Photosensitive resin composition

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

Photosensitive compositions and applications thereof

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation.

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Tokyo, Japan

Makoto Horii