Hitachi-kokusai Electric Inc.

Kokusai Electric Corporation

Makoto Hirano

Akihiro Yoshida

Akinari Hayashi

Yusaku Okajima

Yuji Takebayashi

Hideto Tateno

Makoto Tsuri

Koji Shibata

Norichika Yamagishi

Tomoya Matsui

Haruyuki Miyata

A technique for improving uniformity of film thickness on substrates, includes a substrate processing apparatus having a substrate retainer including substrate and partition plate supports; a reaction tube; a first driver vertically moving the substrate retainer into or out of the reaction tube; a second driver vertically moved by the first driver and rotating the substrate retainer to change a distance between a substrate and a partition plate by moving at least one of the substrate or the partition plate support; a heater; a gas supplier comprising a nozzle; a gas exhauster; and a controller controlling the first driver, the second driver and the gas supplier such that a gas is supplied to the substrate while changing at least one of a relative position of the substrate and a relative position of the partition plate with respect to a hole of the nozzle by driving the second driver.

Substrate processing apparatus, elevator and method of manufacturing semiconductor device

There is provided a technique that includes a process chamber configured to process a substrate; a transfer chamber in communication with a lower portion of the process chamber, and configured to transfer the substrate to a substrate support disposed in the process chamber, and a heating chamber in communication with a lower portion of the transfer chamber, and configured to heat the substrate support and the substrate.

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Provided is a substrate processing apparatus including a substrate container transfer device configured to transfer a substrate container accommodating a substrate and purge an inside of the substrate container; a purge gas supply unit installed at the substrate container transfer device and configured to supply a purge gas into the substrate container; a substrate container standby unit configured to accommodate the substrate container; a contact preventing unit installed at the substrate container standby unit and configured to prevent a contact between the purge gas supply unit and the substrate container standby unit when the substrate container is transferred to the substrate container standby unit by the substrate container transfer device; and a control unit configured to control the substrate container transfer device and the purge gas supply unit.

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

A substrate processing apparatus includes a processing vessel configured to process a substrate; a first purging part configured to perform a first purge to supply inert gas at a first flow rate into a substrate container accommodating the substrate; and a second purging part configured to perform a second purge to supply inert gas at a second flow rate into the substrate container, the second flow rate being lower than the first flow rate.

Substrate processing apparatus, purging apparatus, method of manufacturing semiconductor device, and recording medium

Fan filter unit

Adverse effects when a carrier is open, such as particles adhesion to the substrate or natural oxidation film deposits on the substrate, as well as a rise in oxygen concentration and contamination of the substrate transfer chamber are prevented. Semiconductor manufacturing apparatus includes a carrier in which a cover unit is provided on a substrate loading/unloading opening for loading and unloading a substrate, a carrier open/close chamber continuously arranged to the carrier, a substrate transfer chamber continuously arranged to the carrier open/close chamber, a substrate processing chamber continuously arranged to the substrate transfer chamber, an exhaust means for exhausting the atmosphere in the carrier open/close chamber by suction, and an exhaust quantity adjuster means for adjusting the suction exhaust quantity of the exhaust means.

Semiconductor manufacturing apparatus and semiconductor device manufacturing method

The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holderfor holding substratesin a multistage manner and a substrate transfer unitfor transferring the substratesinto the substrate holder, wherein a substrate holding condition of the substrate holderis sensed by a sensing section. The sensing sectionhas photo-sensors, and sensing waveforms sensed by the photo-sensorsare compared with a normal waveform. A control sectionis provided, which controls a substrate transfer unitsuch that substratesother than at least a substratethat was determined to be abnormal are transferred by the unit.

Substrate treatment equipment and manufacturing method of substrate

The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder for holding substrates in a multistage manner and a substrate transfer unit for transferring the substrates into the substrate holder, wherein a substrate holding condition of the substrate holder is sensed by a sensing section. The sensing section has photo-sensors, and sensing waveforms sensed by the photo-sensors are compared with a normal waveform. A control section is provided, which controls a substrate transfer unit such that substrates other than at least a substrate that was determined to be abnormal are transferred by the unit.

Method of manufacturing a semiconductor device

A processing furnace for performing prescribed heat treatment on plural substrates, a boat for carrying the plural substrates that are laid one over another in the boat into and out of the processing furnace, a substrate detecting sensor for detecting the plural substrates laid one over another in the boat by changing a relative position of the substrate detecting sensor with respect to each of the plural substrates, and a control section for registering reference positions of the plural substrates and an allowable range of positional deviations from the reference positions of the plural substrates are provided. The control section receives pieces of position information of the plural substrates measured by the substrate detecting sensor, compares a maximum value of pieces of position information of substrates with an average thereof and compares a minimum value of pieces of position information of substrates with an average thereof if the pieces of position information of the plural substrates are out of the allowable range of positional deviations from the reference positions of the plural substrates, and judges that deviation has occurred in a boat stop position if differences determined by the respective comparisons are within the allowable range of deviations of the substrates.

Growing community of inventors

Toyama, Japan

Makoto Hirano