Nippon Telegraph and Telephone Corporation

Canon Kabushiki Kaisha

Nippon Chemi-Con Corporation

Mitsubishi Electric Corporation

Makoto Hirano

Takashi Matsumoto

Shintaro Watanabe

Hirotoshi Yano

Hiroshi Kage

Toshiaki Tanaka

Tsuneo Tokumitsu

Ichihiko Toyoda

Kentaro Hashimoto

Masami Tokumitsu

Kazuyoshi Asai

Yuhki Imai

Susumu Ando

Ikuo Hagiwara

Masayuki Fujiwara

Hiromitsu Kanada

Keiichi Endo

Shoji Mochizuki

Motoi Nagamine

Yuya Shigeyoshi

Akira Hidaka

Masayoshi Sato

A control apparatus includes a controller. The controller is configured to obtain a measurement value of a state of mechanical equipment corresponding to a period in which the mechanical equipment reaches a second state from a first state, extract at least one predetermined feature value by using the measurement value, and extract data for machine learning from data of the at least one predetermined feature value on a basis of a separation degree for distinguishing the first state and the second state from each other.

Control method, control apparatus, mechanical equipment, and recording medium

A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the conventional flat strip type conductors present physical limitations to achieving such an objective. The new conductor configuration not only overcomes such circuit packing problems of the conventional line design, but provides additional improvements in performance parameters, such as lower resistance and lower parasitic interactions, an ability to fabricate circuits to design specifications and to improve reliability at low cost. The new concept has been applied to the fabrication of transmission lines, capacitors, inductors, air bridges and to formulating the fabrication steps for a FET. Polyamide film enables an improved fabrication step to be performed in the invention, and a new processing technique for polyimide material has also been demonstrated.

Forming a gate electrode on a semiconductor substrate by using a

A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the conventional flat strip type conductors present physical limitations to achieving such an objective. The new conductor configuration not only overcomes such circuit packing problems of the conventional line design, but provides additional improvements in performance parameters, such as lower circuit resistance and lower parasitic interactions; an ability to fabricate circuits to design specifications and to improve reliability at low cost. The new concept has been applied to the fabrication of transmission lines, capacitors, inductors, air bridges and to formulating the fabrication steps for a FET. Polyimide film enables an improved fabrication step to be performed in the invention, and a new processing technique for polyimide material has also been demonstrated.

Method of fabricating circuit elements on an insulating substrate

Process of fabricating a circuit element for transmitting microwave

Dewall plating technique

There is disclosed a chip type capacitor characterized by comprising a capacitor having lead wires derived from a terminal thereof and a sheathing frame having an accommodating space compatible with a dimension of an external shape of said capacitor, wherein a protuberance of a height substantially identical to the dimension of an external diameter of the lead wires of the capacitor is provided on the underside of the sheathing frame and the lead wires of the capacitor accommodated in the sheathing frame are bent alongside from an end of the aperture of the sheathing frame to the underside of the sheathing.

Chip type capacitor and manufacturing thereof

Growing community of inventors

Tokyo, Japan

Makoto Hirano