Tomoegawa Co., Ltd.

Enplas Corporation

Aikawa Iron Works Co., Ltd.

Smk Corporation

Makoto Goto

Nobuhiro Hashimoto

Masayoshi Suzuki

Shimpei Morioka

Masahiro Tanazawa

Makoto Suzuki

Mitsuhiro Yoshida

Kyoichi Sasaki

Tadahito Sasaki

Kohei Homma

Mitsuyoshi Takanashi

Yoshihiro Goto

Masahiko Hamada

A refiner for beating a raw material supplied between a stator beating part and a rotor beating part, and discharging the beaten raw material, the refiner including a rotating shaft, the rotor beating part attached to the rotating shaft, a motor configured to drive the rotating shaft; and a motor control part configured to variably control a rotation of the motor. The rotation of the motor of the rotor beating part is controlled by the motor control part to beat the raw material.

Refiner

To provide a cleaner configured so that the cleaner can accurately remove dust and dirt, will leave less adhesive residue, and can sufficiently clean areas including an end surface of a ferrule and a guide pin. A cleaner is provided with an adhesive layer having an exposed surface facing an end surface of a connector from which a guide pin protrudes, the adhesive layer being elastically deformable when subjected to contact with the guide pin, and a holding part having a holding wall for holding the adhesive layer while exposing at least the exposed surface, the holding part being capable of bringing the guide pin into contact with the adhesive layer at a position at which the distance from the guide pin to the holding wall is greater than the length of the guide pin.

Cleaner

To provide a connector cleaning tool capable of precisely removing dust even on an end surface of a connector having irregularities. The connector cleaning tool includes a buffer body, and an adhesive body arranged with the buffer body, in which in a case where the connector cleaning tool is pressed toward a connection end surface of a connector on which a guide pin is protrudingly provided, the guide pin is inserted into the buffer body via the adhesive body.

Connector cleaning tool

Provided is an optical-electrical composite cable in which, even if the entire optical-electrical composite cable having an optical fiber routed along flexible flat wiring boards is made thin, the optical fiber is not deformed or damaged by a large bending stress. A pair of the flexible flat wiring boards are disposed on a front surface side and a rear surface side of the optical fiber, and a covering member integrates the entirety thereof. Thus, even if the optical-electrical composite cable is made thin, the cable is not bent with a large curvature without deformation of the optical fiber.

Optical-electrical composite cable

A lens array fabrication method for fabricating a lens array includes: receiving pins () of a film attaching instrument (jig) in second guide holes () of a film-containing base plate; bonding a placement area and an adhesion layer (F); removing the pins (); causing a detachment between a first detachment film (C) and a pressure-sensitive adhesive optical film (D); separating three layers (D) to (F) from two layers (B) and (C); receiving the pins () in first guide holes () of a lens array main unit; fitting a film holding protrusion () in a depression part (); bonding the film (D) to a bonding region (i); removing the pins (); and causing a detachment between the film (D) and a second detachment film (E).

Lens array fabrication method, and film containing base plate and film attaching instrument employed in same

A lens array fabrication method for fabricating a lens array includes: receiving pins of a film attaching instrument (jig) in second guide holes of a film-containing base plate; bonding a placement area and an adhesion layer (F); removing the pins; causing a detachment between a first detachment film (C) and a pressure-sensitive adhesive optical film (D); separating three layers (D) to (F) from two layers (B) and (C); receiving the pins in first guide holes of a lens array main unit; fitting a film holding protrusion in a depression part; bonding the film (D) to a bonding region (i); removing the pins; and causing a detachment between the film (D) and a second detachment film (E).

Growing community of inventors

Shizuoka, Japan

Makoto Goto