Murata Manufacturing Co., Ltd.

Makoto Fukuda

Tadahiro Nakagawa

Shingo Okuyama

Takehiko Miura

Hiromichi Tokuda

Tsuyoshi Tatsukawa

The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.

Method for manufacturing electronic component and apparatus for manufacturing the same

A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.

Laminated ceramic electronic components and manufacturing method therefor

Method for manufacturing electronic component

A manufacturing method for a laminated ceramic electronic component includes the steps of printing a layer of a conductor and a ceramic green sheet formed around the conductor a plurality of times on a carrier film, thus preparing a composite sheet laminate in which composite sheets made up of the conductor and the ceramic green sheet are laminated, and pressing and attaching the composite sheet laminate to another ceramic green sheet and removing the carrier film.

Manufacturing method for a laminated ceramic electronic component

An electrode is formed on a chip-like electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip-like electronic part. The electrode is formed by applying a first band of conductive material to at least one of the side surfaces and applying a second band of conductive material to the remaining side surface(s) in such a manner that the first and second bands meet at respective ones of the edges and together form a continuous band of conductive material extending around the outer periphery of the chip-type electronic part. The chip-like electronic part is held by a holder with a first plurality of side surfaces being exposed and facing a paste base on which a streak of conductive material is placed. The holder and paste base are brought together so that the first band of conductive material is applied to the first plurality of side surfaces. The chip-like electronic part is then repositioned with its remaining side surfaces being exposed and facing a paste base and the second band of conductive material is applied to those side surfaces.

Apparatus for forming electrode of chip-like electronic part

A method of forming an electrode of electronic component part which comprises: filling conductive paste in a slit of a slit plate, the slit being nearly equal to the width of an electrode to be formed and having an opening in the upper surface of the slit plate, making a rubber plate in contact with the side of the lower surface of the slit plate, making an electronic part in contact with and pressing against the upper surface of the slit plate, making the rubber plate deform so that the upper surface of the rubber plate protrudes into the slit, and by the deformation making the conductive paste protrude over the slit and adhere to the lower surface of the electronic part.

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Takefu, Japan

Makoto Fukuda