Sumitomo Chemical Company, Limited

Intel Corporation

Zeon Corporation

Makoto Fujimura

Tadashi Ohsumi

Norio Kimura

Hirotaka Takano

Junichi Sato

Hiroko Yamazaki

Youhei Tateishi

Noriko Ohsawa

Takayuki Saito

Akihiro Tanabe

Tadayuki Ohmae

Takashi Tsutsumi

Kimitoshi Umeda

Takashi Iga

Masato Mizutani

Shigeo Yamamoto

Tadashi Sakurai

Kazuya Ujihara

Tomoyuki Kusaba

Tsuguhiro Katoh

Kouichiro Asao

Tomohiro Teramae

Takashi Chinuki

Takeshi Sakano

Yohei Tateishi

Masafumi Kawasaki

Miki Hayashi

A radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

Radiation-sensitive resin composition and electronic component

Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the laminate; forming a via hole in the cured resin layer; peeling the supporting body from the cured composite; performing a second heating of the cured composite; removing resin residue in the via hole of the cured composite; and forming a conductor layer on an inner wall surface of the via hole by electroless plating or a combination of electroless plating and electrolytic plating.

Laminate production method

Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the laminate; forming a via hole in the cured resin layer; peeling the supporting body from the cured composite; performing a second heating of the cured composite; removing resin residue in the via hole of the cured composite; and forming a conductor layer on an inner wall surface of the via hole.

The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 &#x3bc;m and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.0 mass % or less and a thickness of 25 &#x3bc;m or less, and the curing of the heat-curable resin composition layer occurs at a temperature that is not less than the glass transition temperature of the material of the release substrate.

Manufacturing method for multi-layer printed circuit board

A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.

Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article

A resin composition comprising a binder resin (A), a phenoxy resin having a hydroxyl equivalent of 300 or more, and a cross-linking agent (C). The resin composition of the present invention preferably further comprises a photoacid generator (D). The photoacid generator (D) is more preferably a quinone diazide compound.

Resin composition

An insulating adhesive by having a plateable layer which is comprised of a plateable layer-use resin composition which contains a polar group-containing alicyclic olefin polymer (A1) and a curing agent (A2) and an adhesive layer which is comprised of an adhesive layer-use resin composition which contains a polar group-containing alicyclic olefin polymer (B1), a curing agent (B2), and an inorganic filler (B3), wherein a ratio of content of the polar group-containing alicyclic olefin polymer (A1) to the solid content as a whole which is contained in the plateable layer is 50 to 90 wt %, and a ratio of content of the polar group-containing alicyclic olefin polymer (B1) to the solid content as a whole which is contained in the adhesive layer is 1 to 30 wt % and a ratio of content of the inorganic filler (B3) is 50 to 90 wt % is provided.

Insulating adhesive film, prepreg, laminate, cured article, and composite article

A plant disease-controlling agent containing as an effective ingredient a pyrazoline derivative represented by the general formula ##STR1## wherein, R.sup.1 to R.sup.4 denote hydrogen atoms, etc., R.sup.5 denotes a hydrogen atom, etc., R.sup.6 and R.sup.7 are the same or different and denote optionally substituted hydrocarbon groups, and R.sup.8 and R.sup.9 are the same or different and denote hydrogen atoms, etc., provided that not all of R.sup.1 to R.sup.5 denote hydrogen atoms at the same time. The pyrazoline derivatives represented by the above general formula exhibit excellent control effects on plant diseases.

Plant disease-controlling agent

Method of control plant disease

There is disclosed a dithiocarbonimide derivative of the formula: ##STR1## wherein B is a C.sub.1 -C.sub.6 alkyl group; X is an NH group or an oxygen atom and Y is a nitrogen atom or a CH group, A is a phenyl group, a heterocyclic group, an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, a cycloalkenyl group, a bicycloalkyl group or a tricycloalkyl group, all of which may be substituted. Also disclosed are a fungicidal/insecticidal/acaricidal agent containing the dithiocarbonimide derivative as an active ingredient, an intermediate for use in the production of the dithiocarbonimide derivative, and a process for producing the dithiocarbonimide derivative from the intermediate.

Dithiocarbonimide derivatives useful as acaricidal, fungicidal, and

An antimicrobial substance containing an ethylene copolymer as an active ingredient and an antimicrobial resin composition containing the ethylene copolymer are disclosed. The ethylene copolymer comprises from 40 to 95% by weight of ethylene, from 5 to 60% by weight of at least one dialkylaminoalkylacrylamide comonomer represented by formula (I): ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group: R.sub.2 and R.sub.3, which may be the same or different, each represents an alkyl group having from 1 to 4 carbon atoms; and n represents an integer of from 2 to 5, and up to 20% by weight of one or more of other ethylenically unsaturated comonomers, and has a number average molecular weight of from 5,000 to 50,000.

Antimicrobial substance and antimicrobial resin composition containing

A compound having the formula [I]: ##STR1## wherein R.sup.1 is hydrogen atom or a lower alkyl group, R.sup.2 is a lower alkyl group, R.sup.3 and R.sup.4 are the same or different each other and each is a hydrogen atom, a halogen atom, a lower alkyl group, a lower haloalkyl group or a lower alkoxy group, X is an oxygen atom, a sulfur atom or a methylene group, and Ar is a pyrimidine-4-yl group, a pyridine-2-yl group, a pyrazine-2-yl group or a pyridazine-3-yl group each of which may be substituted by one or two substituents selected from the group consisting of a halogen atom, a lower alkyl group, a lower alkoxy group and a nitro group, or a pyrimidine-2-yl group which is substituted by one or two substituents selected from the group consisting of a halogen atom, a lower alkyl group and a lower alkoxy group, a process for preparing the same and agricultural and/or horticultural fungicides containing the same as an active ingredient. According to the present invention, the excellent agricultural and/or horticultural fungicides can be provided.

Growing community of inventors

Tokyo, Japan

Makoto Fujimura