Mitsui Minings & Melting Co., Ltd.

Other

Makoto Dobashi

Hisao Sakai

Junshi Yoshioka

Toshiko Yokota

Susumu Takahashi

Akiko Sugimoto

Mitsuyoshi Matsuda

Naotomi Takahashi

Yasuji Hara

Sakiko Tomonaga

Tsutomu Higuchi

Mitsuo Suzuki

Kazuko Taniguchi

Shinichi Obata

Takuya Yamamoto

Kiyotaka Yasuda

Tsutomu Asai

Hiroshi Hata

Sakiko Taenaka

Masaru Takahashi

Takeo Taguchi

Ken-ichiro Iwakiri

Yutaka Hirasawa

Takashi Kataoka

Hideaki Matsushima

Yoshiaki Kinoshita

Kenichiro Iwakiri

Tetsuhiro Matsunaga

Ayumu Tateoka

Hiroaki Kurihara

Hiroshi Watanabe

Yoshiki Sakaguchi

Akihiro Modeki

Jo Nishikawa

Hitohiko Honda

Akitoshi Takanashi

Tomoyoshi Matsushima

Osamu Nakano

Tomohiro Sakata

Yoshiki Sakaguschi

Shinichi Musha

Shin-ichi Obata

Yoichi Babasaki

Tatsuya Sudo

Present invention provides an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. The electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mmto 100 kgf/mmand has a tensile strength after heating (180&#xb0; C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure.

Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil

It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.

Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 &#x3bc;m to 0.7 &#x3bc;m, the maximum peak to valley height (PV) to be 0.05 to 1.5 &#x3bc;m, and the surface roughness (Rzjis) to be 0.1 &#x3bc;m to 1.0 &#x3bc;m. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

Surface-treated electro-deposited copper foil and method for manufacturing the same

An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film

A negative electrode for a non-aqueous electrolyte secondary cell includes a current collector an, formed on a surface or both surfaces thereof, an active material structure containing an electroconductive material with a low capability of forming a compound with lithium, and the active material structure includes 5% to 80% by weight of active material particles containing a material having a high capability for forming a compound with lithium. The active material structure can include an active material layer containing the active material particles and a surface-covering layer on the active material layer.

Negative electrode for nonaqueous secondary battery, process of producing the negative electrode, and nonaqueous secondary battery

To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layeris an inorganic-oxide sputter film having a thickness of 1.0 &#x3bc;m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer

An anode for a nonaqueous secondary battery comprising a current collector having formed thereon a first covering layer containing tin, a tin alloy, aluminum or an aluminum alloy and a second covering layer containing a metal having low capability of forming a lithium compound in that order. The anode may have an additional first covering layer formed on the second covering layer. A covering layer containing a copper etc. may be formed as an uppermost layer. Each layer can be formed by heat treating to get desired property. As heat treatment can be done in a short time, it has a great cost merit.

Negative electrode for non-aqueous electrolyte secondary cell and method for manufacture thereof, and non-aqueous electrolyte secondary cell

The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200&#xb0;C. For this purpose are adopted 'a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed' and others.

Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method

An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200&#xb0; C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil, which includes an adhesive interface layerarranged on one face of the carrier foiland an electrodeposited copper foil layerarranged on the adhesive interface layer, characterized in that the adhesive interface layeris composed of a metal oxide layer ML and an organic material layer OL, and the like are used.

Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil

The method for electrolytically refining copper makes use of crude copper as an anode and is characterized in that the temperature of the electrolyte in an electrolytic cell is maintained at a level of not less than 55&deg; C.; that the electrolyte is continuously introduced into the electrolytic cell from the top of the cell, continuously discharged from the bottom of the cell along with slime, the slime is removed from the electrolyte discharged from the electrolytic cell and the electrolyte free of any slime is recirculated in the cell; and that the electrolyte is passed through the space between the electrodes at an average electrolyte velocity sufficient for allowing the electrolyte to flow on the whole surface of the cathode downward or in the direction opposite to that of the upward stream of the electrolyte generated on the cathode surface when the electrolysis is initiated while the electrolyte is in the stationary state.

High current density electrolytic decomposition process for copper

To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface layer and copper microparticles are formed on the barrier layer; (2) the anti-corrosion treatment is carried out by use of a plating bath containing a single metallic component or a plurality of metallic components for forming an alloy, the plating bath(s) having a deposition potential less negative than &minus;900 mV (vs. AgCl/Ag reference electrode); and (3) methods (1) and (2) are combined.

Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil

An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.

Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus

An object of the present invention is to reduce and to stabilize peel strength of a carrier foil in an electrodeposited copper foil with carrier employing an organic adhesive interface, thereby facilitating peeling of the carrier foil. The electrodeposited copper foil with carrier of the present invention contains a carrier foil layer, an organic adhesive interface layer formed on the carrier foil layer, and an electrodeposited copper foil layer formed on the organic adhesive interface layer, wherein the difference between the coefficient of thermal expansion of material forming the carrier foil layer at a certain temperature and that of material forming the electrodeposited copper foil at the same temperature is 4&times;10 /deg.C or more.

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil

The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

Electolytic copper foil with carrier foil and method for manufacturing the same

A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

Copper foil for printed wiring board

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Saitama, Japan

Makoto Dobashi