Renesas Electronics Corporation

Olympus Corporation

Renesas Technology Corp.

Kabushiki Kaisha Bandai

Wiz Co., Ltd.

Makoto Araki

Michiaki Sugiyama

Minoru Shinohara

Hiroshi Sasaki

Makio Ueno

Kenichi Imura

Fumio Murakami

Tatsuo Nakata

Yasunari Matsukawa

Ryo Matsumoto

Takayuki Takeda

A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.

Semiconductor device

Three or more devices can be connected to a microscope and can be used simultaneously. Provided is a microscope connecting unit including a microscope connection port that is connected to a microscope used to observe a sample; three or more unit connection ports to which a stimulating unit that irradiates the sample with light or a confocal observation unit or an image capturing unit that detects light generated at the sample is connectable; and two or more light-path combining units that are disposed between the microscope connecting port and the unit connection ports and that combine light paths optically connecting the microscope with the confocal observation unit, the stimulating unit, and the image capturing unit.

Microscope connecting unit and microscope system

A microscope apparatus that can observe into the interior of a specimen and that can apply an optical stimulus over a wide area within a short period of time is provided. The microscope apparatus comprises at least one observation scanning optical system including a laser light source for emitting observation laser light, an objective lens, and a scanning optical system for two-dimensionally scanning the observation laser light in a predetermined examination plane of the specimen via the objective lens; and at least one stimulus optical system which includes a lamp light source for emitting light having a wavelength used for optical stimulation and which irradiates the specimen with the light emitted from the lamp light source.

Microscope apparatus

A multiphoton-excitation laser scanning microscope capable of efficiently collecting fluorescence emitted from a specimen to acquire a brighter multiphoton-excitation fluorescence image is provided. This multiphoton-excitation laser scanning microscope includes a multiphoton-excitation laser light source for emitting ultrashort pulsed laser light, a light-scanning unit configured to scan a specimen with the ultrashort pulsed laser light emitted from the multiphoton-excitation laser light source in two dimensions, an objective lens configured to focus the ultrashort pulsed laser light scanned by the light-scanning unit on the specimen, a collector lens disposed opposite the objective lens, with the light-scanning unit disposed therebetween, to collect fluorescence emitted from the specimen, and a light detector configured to detect the fluorescence collected by the collector lens. The collector lens has a higher numerical aperture and a larger field number than the objective lens.

Multiphoton-excitation laser scanning microscope

Game device

In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

Method of manufacturing semiconductor device

Growing community of inventors

Tokyo, Japan

Makoto Araki