Lexmark International, Inc.

Nikko Company

Makoto Aoki

Jerry Wayne Smith

Kiyoshi Mizushima

Douglas Campbell Hamilton

Larry Earl Stahlman

Hisakazu Hujimoto

Satoshi Ikeda

Noriyuki Tanagi

A tube heater for heating a fluid in an interior of the tube has a stainless steel cylindrical core. The core ranges about 3 to 300 mm in length and about 100 to 200 microns in thickness with an outer diameter of about 8 to 20 mm. An inner surface of the core has dimples and a conductive coating. A patterned resistive layer overlies the core in a thickness of about 9 to 15 microns. The resistive layer is thin- or thick-film printed about a circumference of the core. Two glass layers surround the resistive layer. Each glass layer is electrically insulative. The glass underlying the resistive layer has a thermal conductivity of more than 2 W/mK while the glass overlying the resistive layer has a thermal conductivity of less than or equal to 0.5 W/mK.

Thin-walled tube heater for fluid

A method of making a heater includes an aluminum nitride base having equal to or less than 1% impurities, particularly one embodiment having none of polybrominated biphenyl, polybrominated diphenyl ether, hexabromocyclododecane, polyvinyl chloride, chlorinated paraffin, phthalate, cadmium, hexavalent chromium, lead, and mercury. The base is fired in a heating unit before any layering. Thereafter, on a topside and backside of the base a conductor layer is layered and allowed to settle and dry before firing. Next, a resistive layer is layered on the base from a resistor paste such that the resistive layer connects to the conductor layer on the topside. The resistor paste is allowed to settle and dry and then the base with the conductor and resistor layers is fired. At least four layers of glass are layered next over the resistive layer, each instance thereof including layering a glass, drying the glass and firing.

Making an aluminum nitride heater

A heater includes an aluminum nitride base having equal to or less than 1% impurities, particularly one embodiment having none of polybrominated biphenyl, polybrominated diphenyl ether, hexabromocyclododecane, polyvinyl chloride, chlorinated paraffin, phthalate, cadmium, hexavalent chromium, lead, and mercury. At least one resistive trace of silver and palladium overlies the base as does a conductor of silver and platinum or palladium that electrically connects to the resistive trace to apply an external voltage to the resistive trace for heating thereof. At least four, but optionally five, layers of glass overlie the resistive trace and part of the conductor. A first two consecutive layers of the glass layers define a first glass having a solid content of more than 65% and a viscosity of 100 Pa&#xb7;s or less. The following two or three consecutive layers of the five layers define a second glass dissimilar to the first.

Aluminum nitride heater

A method for forming a ceramic laminate ceramic laminate from first and second sheets of ceramic material, the sheets having a first and a second surface, wherein the first ceramic material has a different coefficient of thermal expansion than the second ceramic material and the outer layers comprises ceramic materials having substantially the same thermal properties, comprising (a) heating the first and the second sheets of ceramic material; (b) stacking the first and the second sheets of ceramic material wherein the second surfaces are opposed to one another to provide stacked sheets; and (c) pressing the stacked sheets and forming the ceramic laminate.

Method for forming a ceramic laminate

A large area heater used, for example, in a laser printer belt fuser or as cooking surface, has an alumina substrate in which two bowed parts of alumina ceramic having opposed concave regions are formed together as a laminate. Electrical resistors are deposited on the laminate. The alumina laminate provides excellent resistance to uneven heating or other thermal stress. Alumina ceramic is readily shaped during manufacture and manufacturing costs and yield are good. A wide variety of large area heaters can usefully employ the laminate.

Large area alumina ceramic heater

A ball-grid-array-type semiconductor device comprising a package substrate constituted with a ceramic wiring board having a semiconductor chip mounting portion on the principal plane and electrodes arranged like an array on the back, a semiconductor chip secured to the principal plane of the package substrate, connection means for electrically connecting the electrodes of the semiconductor chip with the wiring of the wiring board, a sealing body provided for the principal plane side of the wiring board and made of an insulating resin to cover the semiconductor chip and the connection means, a pedestal layer made of low-fusion-point solder and formed on the electrodes, and a metallic ball secured onto the pedestal layer; wherein a buffering layer made of high-fusion-point solder which covers the entire surface of the electrodes and whose margin extends up to a predetermined length on the back of the package substrate is formed on the electrodes and the pedestal layer is formed on the buffering layer.

Ball-grid-array-type semiconductor device and its fabrication method and electronic device

A process for fabricating an electronic component having a hollow packaging structure comprises the steps of: (a) printing an organic polymeric material on at least a portion of a main surface of a ceramic substrate where a ceramic lid is to be bonded and curing the printed organic polymeric material to form a cured product; (c) hermetic sealing the ceramic lid on a surface of the cured product with an organic bonding agent; and preferably (b) irradiating ultraviolet rays onto a surface of said cured product to form activated bonding sites between said steps (a) and (c). According to the process, a hollow package mounted with an electronic component can be fabricated efficiently.

Growing community of inventors

Kanazawa, Japan

Makoto Aoki