Seiko Epson Corporation

Makoto Anan

Takuya Miyakawa

Yoshiaki Mori

Yasuhiko Asano

Yohei Kurashima

Osamu Kurashina

Satoshi Miyamori

Hirofumi Sakai

A method of measuring topology of functional liquid in a pixel, in which thickness or volume of the functional liquid in the pixel is measured by a surface topology measuring apparatus comprising: measuring surface topologies in which surface topology of the functional liquid in the pixel and surface topology of the bank are measured by the surface topology measuring apparatus, and measurement parameters regarding the surface topologies are generated; adding a bank height in which a height parameter of a height of the bank is added to the measurement parameter of a surface of the functional liquid in the pixel of the measurement parameter generated; and calculating topology in which the thickness or the volume of the functional liquid in the pixel is calculated based on the added measurement parameter of the surface of the functional liquid in the pixel and the measurement parameter of the surface of the bank.

Method of measuring topology of functional liquid droplet in pixel, topology measuring apparatus of functional liquid in pixel, liquid ejection apparatus, method of manufacturing electro-optical apparatus, electro-optical apparatus, and electronic apparatus

High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.

Method and apparatus for bonding using brazing material

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Chino, Japan

Makoto Anan